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仪器自主化关键一步!东华大学流变仪器联合实验室亮相
仪器信息网·2025-10-21 09:09

Core Viewpoint - The establishment of the "Rheological Instrument Innovation Research Laboratory" at Donghua University marks a significant step in addressing the reliance on imported rheological testing technology and instruments, aiming to enhance innovation in the new materials sector [2][3][4]. Group 1: Laboratory Establishment - The laboratory was officially inaugurated on October 15, 2025, by key figures including Donghua University's Party Secretary Liu Chenggong and Shanghai Inspection and Testing Certification Association Chairman Tao Yonghua [3]. - The laboratory aims to tackle the challenges in the rheological measurement technology field, which is crucial for various industries such as polymers, biomedicine, food chemistry, and aerospace [4]. Group 2: Addressing Industry Challenges - The high-end rheological instrument market is currently dominated by a few international manufacturers, which restricts China's independent innovation in new materials [4]. - The laboratory will focus on developing domestic technologies for core modules of rheological instruments, including micro-mechanical sensors and dynamic signal processing [6]. Group 3: Collaborative Innovation - The laboratory will adopt a full-chain innovation model, integrating basic theory, instrument development, and industry validation to provide a complete technical loop for polymer material development [6]. - It aims to collaborate with upstream and downstream enterprises to establish standard systems and promote the industrial application of domestic rheological instruments in strategic fields such as new energy battery separators and biomedical polymers [6]. Group 4: Industry Significance - The establishment of the laboratory is expected to reshape the rheological instrument ecosystem and support China's strategy to become a materials powerhouse [7]. - The laboratory's technological advancements are anticipated to accelerate original innovation capabilities in new materials, providing critical support for high-end manufacturing sectors like aerospace and semiconductor packaging [7].