国芯网·2025-10-23 04:46Core Viewpoint - TSMC has decided not to purchase the high numerical aperture (High-NA) EUV lithography machine from ASML, which costs up to $400 million, opting instead for a cost-effective alternative using pellicle technology to enhance chip manufacturing processes [1][3][4]. Group 1: Decision on Equipment Procurement - TSMC faces manufacturing bottlenecks as it advances to 1.4nm and 1nm technology nodes, leading to the decision to forgo the purchase of the High-NA EUV lithography machine [1][3]. - The company believes that the value provided by the High-NA EUV machine does not justify its high cost, prompting a shift to pellicle technology to protect photomasks during the lithography process [4][5]. Group 2: Pellicle Technology Overview - Pellicle technology serves to protect photomasks from dust contamination, thereby improving yield and usage rates in chip manufacturing [4]. - The materials used for pellicles include ultra-thin silicon nitride and carbon films for EUV, which must have high transparency and low absorption rates [4]. Group 3: Challenges and Implications - While the pellicle solution reduces capital expenditure, it introduces new technical challenges, requiring more exposure steps to achieve the necessary precision for 1.4nm and 1nm chips [5]. - Increased usage frequency of photomasks may slow down production rates and pose potential risks to chip yield, necessitating extensive trial and error to optimize reliability [5]. - TSMC's decision is also influenced by the limited supply of High-NA EUV machines, with ASML producing only five to six units annually, making it impractical for TSMC to invest heavily in a few machines while needing to meet large demands from clients like Apple [5].