LG化学，推出尖端半导体封装新材料

Core Viewpoint - LG Chem has developed advanced liquid PID (Photo Imageable Dielectric) materials for semiconductor packaging, targeting the artificial intelligence and high-performance semiconductor markets, highlighting the increasing importance of PID in high-precision circuits [2][4]. Group 1: Product Features - The liquid PID material offers high resolution, stable curing at low temperatures, low shrinkage, and low absorption rates, enhancing process stability [2]. - The new PID is free from PFAS, NMP, and toluene, aligning with environmental regulations [2]. - LG Chem has also developed a film-type PID to address issues of uniformity on large substrates, which include maintaining consistent thickness and graphic fidelity, high strength and elasticity to reduce cracking during thermal cycles, low moisture absorption for long-term reliability, and compatibility with existing processes [3]. Group 2: Expansion in Semiconductor Packaging - LG Chem is expanding its production and R&D scale in key backend materials for advanced semiconductor packaging, which includes products such as Copper-Clad Laminate (CCL), Die Attach Film (DAF), Non-Conductive Film (NCF), and Build-Up Film (BUF) [3].