DT新材料·2025-10-31 06:06Core Insights - The article discusses the increasing importance of thermal management solutions in the AI mobile phone era, highlighting the challenges posed by rising power consumption and the need for efficient cooling systems [5][6]. Group 1: Industry Trends - The demand for high-performance AI chips is expected to lead to thermal design power exceeding 1000W, pushing the limits of traditional cooling methods [5]. - The mobile phone industry's pursuit of thinner and more integrated designs is creating constraints on internal cooling space, necessitating innovative thermal management solutions [5][6]. Group 2: Company Innovations - Apple has introduced VC (Vapor Chamber) technology in its iPhone 17 Pro/Pro Max models, achieving a 300% improvement in passive cooling efficiency, resulting in a temperature reduction of 6-12°C during high-load gaming [7]. - Huawei's upcoming Mate 80 series is expected to utilize micro-pump liquid cooling technology, which features high precision and efficiency through rapid circulation of cooling liquid [8]. - OPPO's self-developed "疾风散热引擎" (Swift Cooling Engine) enhances air cooling performance by 120% and reduces module size by 70% while achieving high waterproof ratings [8]. - Xiaomi's circular cold pump cooling system reportedly improves cooling efficiency by 300% compared to traditional VC technology, with a temperature drop of 7.2°C in high-load scenarios [9]. Group 3: Key Suppliers - Siquan New Materials specializes in thermal management materials, providing a complete system from basic materials to integrated solutions, serving major clients like Xiaomi and Samsung [11]. - Suzhou Tianmai offers a comprehensive range of thermal interface materials and solutions, catering to leading companies in telecommunications and new energy vehicles [11]. - Technology is a leading provider of high-performance synthetic graphite thermal solutions, serving top global consumer electronics brands [12]. - Shenzhen Hongfu Cheng focuses on advanced thermal interface materials for high-power AI chips and other applications [15]. Group 4: Upcoming Events - The sixth Thermal Management Industry Conference and Expo will showcase the latest products from key thermal management suppliers, inviting professionals from various sectors to participate in technical exchanges and explore innovative directions in thermal management [21].