材料汇·2025-11-05 15:57Core Insights - The article emphasizes the strategic importance of SiC (Silicon Carbide) as a potential interposer material for advanced packaging solutions by Nvidia and TSMC, with a planned introduction by 2027, indicating a shift towards addressing thermal management challenges in AI computing [3][4]. - The competition in AI computing is shifting focus from transistor density to packaging and thermal management capabilities, highlighting the critical role of heat dissipation in chip performance [3][4]. - SiC is positioned as the optimal solution for CoWoS (Chip on Wafer on Substrate) interposers, balancing performance and feasibility, while traditional materials like diamond and glass fall short in practicality [3][4]. - The adoption of SiC in CoWoS could create a significant new market, particularly benefiting the mainland Chinese SiC industry due to aggressive investments in substrate capacity and cost advantages [3][4]. Group 1: SiC as Interposer Material - Nvidia and TSMC are considering SiC for future advanced packaging, with plans to implement it by 2027 [4]. - SiC is expected to address the thermal management issues associated with CoWoS packaging, which is crucial for the performance of AI chips [3][4]. - The transition to SiC interposers is seen as a strategic move to maintain competitive advantages in the semiconductor industry [3][4]. Group 2: Thermal Management Challenges - The article highlights the increasing power requirements of Nvidia's GPUs, necessitating improved cooling solutions to manage heat dissipation effectively [23][25]. - The CoWoS packaging technology is critical for high-performance computing, and any limitations in thermal management could hinder chip performance and reliability [25][37]. - SiC's high thermal conductivity (490 W/m·K) significantly outperforms silicon (130 W/m·K) and glass, making it a superior choice for managing heat in advanced packaging [105][106]. Group 3: Market Implications - The potential shift to SiC interposers could unlock a substantial new market, moving SiC from a niche power electronics market to a broader AI and data center infrastructure market [15][111]. - The mainland Chinese SiC industry is poised to benefit from this transition, leveraging its investments and production capabilities to capture a share of the global semiconductor supply chain [3][4][113]. - The expected growth in CoWoS capacity, projected at a compound annual growth rate of 35%, underscores the increasing demand for advanced packaging solutions [112].