双11限定福利！液冷·热管理·热设计资料（PPT+研报）限时开放领取

Core Insights - The article promotes a knowledge package related to thermal management technologies, particularly focusing on liquid cooling, thermal interface materials (TIM), AI cooling, and thermal design trends for 2025 [2][3]. Summary by Sections Gift Package Content - The knowledge package includes 18 technical documents on thermal design from various manufacturers, covering cutting-edge research and practical engineering applications [4]. - It features a collection of international reports and core technical documents from leading companies, providing a comprehensive overview of the thermal management industry [3][5]. Highlights of the Materials - The materials serve as both research references and insights into global thermal management technology trends [5]. - Key documents include high-power chip packaging, cooling structure optimization, and system-level thermal simulation cases [6]. Participation Details - The event runs from November 6 to November 11, coinciding with the shopping festival, encouraging participants to enhance their knowledge while shopping [8]. - Participants can receive the knowledge package by sharing the article on social media and sending a screenshot to the organizers [11]. Upcoming Events - The 6th Thermal Management Industry Conference and Exposition will take place from December 3 to December 5, 2025, in Shenzhen, featuring various specialized forums on thermal management [13][19].