热管理材料报告解读｜超强嘉宾阵容+干货议程，速来！

Core Insights - The iTherM 2025 conference will focus on the development of thermal management technologies in various industries, including electronics, new materials, and green energy, aiming to explore the latest trends and innovations in the thermal management sector [2][3]. Event Details - The conference is scheduled for December 3-5, 2025, at the Shenzhen International Convention and Exhibition Center, China [3][59]. - The theme of the conference is "Fusion · Innovation | Delivering a Little More" [3]. Key Presentations - Liquid Metal Chip Cooling Technology: Researcher Deng Zhongshan will discuss advancements in liquid metal thermal management technologies for chip cooling applications, including liquid metal thermal interface materials and their prospects in 5G and consumer electronics [3][6]. - High-Performance Thermal Management Materials: Researcher Yu Hengda from Henkel will present innovative solutions for high thermal conductivity materials, addressing challenges in assembly efficiency and reliability [4]. - Multi-Functional Thermal Interface Materials: Researcher Zhu Guimei will report on the latest developments in thermal interface materials using liquid metals [5][6]. - Electronic Packaging Thermal Management Composites: Researcher Lin Zhengde will focus on solutions for thermal transport systems in electronic packaging, overcoming challenges in material arrangement and interface heat transfer [7][8]. - Series of Thermal Interface Materials for Various Scenarios: Researcher Liu Bin will discuss the development of thermal interface materials tailored for AI chips, robotics, and flexible devices [9][10]. Research Focus Areas - Micro-Nano Thermal Conductivity Mechanisms: Researcher Zhang Xudong will explore the thermal conductivity mechanisms and applications of liquid metal thermal interface materials [11]. - Self-Healing Flexible Thermal Interface Materials: Researcher Xu Cui will present a new type of thermal interface material that can self-repair and maintain long-term reliability [13][14]. - Thermal Resistance and Bonding Studies: Researcher Zeng Xiaoliang will discuss the relationship between bonding strength and thermal resistance in thermal interface materials [15][16]. - High-Performance Metal Thermal Interface Materials: Researcher Pan Lin will focus on advancements in metal thermal interface materials and their applications in high-performance computing [21][22]. Industry Challenges - The conference will address challenges in thermal management materials for ICT products, particularly in high reliability and performance requirements due to increasing device integration [23][24]. - Researcher Yang Jie will discuss the enhancement of interfacial heat transfer in polymer-based composite materials [25][26]. Conclusion - The iTherM 2025 conference aims to create a professional communication platform for the thermal management industry, facilitating discussions on new technologies, materials, and trends [2][3].