国芯网·2025-11-25 10:54Core Insights - The semiconductor industry is increasingly seeking alternative solutions due to the ongoing tight capacity for advanced packaging at TSMC, with Marvell and MediaTek evaluating the integration of Intel's EMIB technology into their ASIC chip designs [2][4]. Group 1: Industry Challenges - TSMC faces dual challenges: the inability to rapidly expand its advanced packaging capacity in the short term and the demand from U.S. clients for localizing the entire supply chain, which TSMC's U.S. backend capacity is not yet fully equipped to meet [4]. Group 2: Technological Developments - Intel's EMIB technology, which utilizes a 2.5D packaging architecture, is gaining attention for its unique advantages in heterogeneous chip integration [4]. - Recent job postings from leading companies like Apple, Qualcomm, and Broadcom explicitly mention EMIB-related positions, indicating a proactive approach to talent acquisition in the advanced packaging sector [4]. - Intel's newly launched 3.5D packaging technology achieves higher chip interconnect density through more precise silicon vias, further enhancing its competitive edge [4]. Group 3: Market Dynamics - The embedded bridge solution used in EMIB offers advantages in cost control and yield improvement compared to traditional intermediary layer designs, making it a key focus as advanced process evolution slows down [4]. - The shift of multiple companies towards the EMIB solution not only reflects current supply chain adaptation strategies but may also reshape the competitive landscape of the semiconductor packaging industry [4].