东丽，聚酰亚胺再突破！

Core Viewpoint - Toray Industries has developed a high-performance polyimide material for semiconductor back-end processes, which is set to be mass-produced by 2028, addressing both technical and environmental requirements [2][3]. Group 1: Material Development - Toray's new temporary bonding material is suitable for semiconductor wafers with a thickness of 30 micrometers or less and is free from harmful substances like perfluoroalkyl and N-methylpyrrolidone [2]. - The material boasts an elastic modulus 2.5 times that of traditional products and a total thickness variation of ≤1.0 micrometer, solving issues related to deformation and uneven pressure during back grinding [2]. - The applications of this material span across AI semiconductors, NAND flash memory, and power semiconductors, aligning with the needs of next-generation vertical stacking technologies [2]. Group 2: Industry Trends - The semiconductor industry is transitioning towards advanced manufacturing technologies such as 3D integration and heterogeneous integration, necessitating thinner wafers [3]. - Advanced packaging technologies require wafer thickness reductions to 50 micrometers or even below 20 micrometers [3]. Group 3: Temporary Bonding Materials - The core function of temporary bonding materials is to provide mechanical support during the processing of ultra-thin wafers (≤50μm) to prevent warping and cracking [4]. - Various types of temporary bonding materials include epoxy-based, wax-based, silicone-based, and polyimide-based, with polyimide being the most promising due to its excellent thermal stability and mechanical strength [8]. - Polyimide-based temporary bonding adhesives can be categorized into thermal release, laser release, and chemical release types, each suited for different applications [8]. Group 4: Market Dynamics - The global market for polyimide-based temporary bonding adhesives is dominated by international giants like JSR, Brewer Science, and Dow DuPont, while domestic players are accelerating breakthroughs [9]. - The temporary bonding adhesive market is projected to grow from $236 million in 2024 to $402 million by 2031, with a CAGR of 8.0%, significantly outpacing the overall temporary bonding materials market [11]. - The Chinese market is expected to grow from 450 million RMB in 2024 to 1.26 billion RMB by 2030, with a CAGR of 20.3%, driven by the acceleration of domestic semiconductor advanced packaging [11].