Core Viewpoint - The conference emphasizes the importance of thermal management technology in various key sectors, including AI computing, advanced packaging, new energy, and electric vehicles, aiming to drive innovation and collaboration within the industry [2][5][19]. Group 1: Conference Overview - The 6th Thermal Management Industry Conference and Expo, hosted by DT New Materials, took place in Shenzhen, gathering experts from academia and industry to discuss technological innovations and engineering practices in thermal management [2]. - The conference featured multiple forums and discussions on trending applications such as AI data centers, advanced packaging, power devices, and liquid cooling technology, providing a comprehensive communication platform for the industry [4][19]. Group 2: Keynote Highlights - Dr. Zhang Lisheng, CEO of DT New Materials, highlighted Shenzhen's role as a hub for electronic information and advanced manufacturing, aiming to create a robust ecosystem for thermal management, integrated circuits, and new materials [5][7]. - Notable presentations included topics on directional heat transfer mechanisms, thermal management in communication and AI products, and intelligent thermal control mechanisms, showcasing advancements in materials and system-level solutions [9][10][12][14][16]. Group 3: Industry Trends and Innovations - The conference discussions revealed key trends such as high heat flux density, advanced packaging, and the engineering of liquid cooling systems, indicating the main development lines for the industry over the next 3-5 years [52]. - The exhibition area featured numerous new products and solutions, facilitating direct interactions between engineers and procurement leaders, leading to potential collaborations [53]. Group 4: Future Outlook - The conference aims to create tangible value for the industry through connectivity and collaboration, with ongoing discussions between academic experts and industry representatives for future research and project implementations [56][59]. - More forums and significant content updates are expected in the following days, reflecting the growing importance of thermal management in the era of increased computational power [59].
今日“热热热”管理继续!昨日“人人人”精彩回顾
DT新材料·2025-12-03 16:04