1300+份新材料报告下载：做新材料领域的「攻坚者」

Core Viewpoint - The article discusses the rapid growth and investment opportunities in advanced packaging materials, highlighting the potential for domestic companies to replace foreign suppliers in critical sectors [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI, epoxy resin, and conductive adhesives are identified as key growth areas, with significant market size and growth forecasts [8]. Investment Opportunities - The article outlines various advanced packaging materials and their respective market sizes, including: - PSPI: $528 million in 2023, expected to grow significantly [8]. - Conductive adhesives: projected to reach $3 billion by 2026 [8]. - Chip bonding materials: estimated at $485 million in 2023, with a forecast of $684 million by 2029 [8]. - The article emphasizes the importance of domestic companies in capturing market share from established foreign competitors [7][8]. Industry Players - Key domestic companies mentioned include 鼎龙股份, 国风新材, and 三月科, which are positioned to benefit from the growing demand for advanced packaging materials [8]. - Foreign competitors such as Fujifilm, Toray, and Dow are also highlighted, indicating the competitive landscape [8]. Future Trends - The article suggests that the next few years will be critical for the development of advanced packaging materials, with increasing investments expected in R&D and production capacity [8]. - The shift towards domestic production is seen as a strategic move to reduce reliance on foreign imports, particularly in high-tech sectors [7][8].