材料汇·2025-12-28 15:55Core Viewpoint - The article discusses the rapid growth and investment opportunities in advanced packaging materials, highlighting the potential for domestic companies to replace foreign imports in this sector [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI, epoxy resin, and conductive adhesives are identified as key growth areas, with significant market size and growth forecasts [8]. Investment Opportunities - The article outlines various advanced packaging materials and their respective market sizes, including: - PSPI: $528 million in 2023, expected to grow significantly [8]. - Conductive adhesives: projected to reach $3 billion by 2026 [8]. - Chip bonding materials: estimated at $485 million in 2023, with a forecast of $684 million by 2029 [8]. - Domestic companies like Dinglong Co., Guofeng New Materials, and others are positioned to capitalize on these growth opportunities [8]. Competitive Landscape - The article compares domestic and foreign companies in the advanced packaging materials sector, noting that while foreign firms like Fujifilm and Toray dominate, domestic players are emerging rapidly [8]. - The competitive dynamics suggest a potential shift towards domestic production as companies seek to reduce reliance on imports [7][8]. Investment Strategies - Different investment stages in the new materials industry are discussed, emphasizing the importance of assessing team capabilities, market potential, and product maturity at each stage [10]. - The article suggests that investments in more mature companies with established sales channels present lower risks and higher returns [10].