DT新材料·2026-01-05 16:04Core Viewpoint - The semiconductor industry is transitioning from FinFET to CFET technology by 2026, marking a shift in chip performance competition from mere size reduction to addressing physical limits and thermal management challenges [2][32]. Group 1: Macro Crisis - The long-term focus on increasing transistor density has led to significant thermal management issues, impacting CPU and GPU performance, power consumption, and energy efficiency [4][6]. - High temperatures can slow down critical signal propagation and cause permanent degradation of chip performance, leading to increased energy consumption for the same computational tasks [7][10]. Group 2: Path Exploration - Chip-level cooling technologies are essential for efficiently dissipating heat from high-density chips, with methods categorized into active and passive cooling systems [12][13]. - Advanced cooling architectures include remote, near-chip, and embedded on-chip cooling, each with varying effectiveness in heat transfer [13]. Group 3: Architectural Revolution - The transition to nanosheet and CFET architectures is expected to increase power density by 12%-15%, raising concerns about thermal runaway in densely packed data centers [34]. - Backside power delivery networks (BSPDN) are being developed to reduce resistance and improve voltage delivery, but they may introduce new thermal challenges due to thinner silicon substrates [35][40]. Group 4: Future Solutions - The industry is exploring various advanced materials and cooling techniques, including microchannel cooling, liquid cooling, and high-performance thermal management materials like diamond composites [20][59]. - Collaborative approaches, such as system and technology co-optimization (STCO), are necessary to address the complex thermal management challenges posed by next-generation chips [48][75].