1300+份新材料报告下载：做新材料领域的「攻坚者」

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific segments such as conductive adhesives are forecasted to reach $3 billion by 2026, while chip bonding materials are expected to grow from approximately $4.85 billion in 2023 to $6.84 billion by 2029 [8]. Key Material Segments - PSPI: The global market is estimated at $528 million in 2023, with a significant increase expected in China [8]. - Al-X Photoresist Materials: The market was valued at $2.64 billion in 2022, with major players including DuPont and Shin-Etsu [8]. - Thermal Interface Materials: Expected to reach 7.6 billion yuan by 2026, indicating strong demand in the semiconductor industry [8]. Investment Strategies - Different investment stages in the new materials industry are outlined, emphasizing the importance of team assessment, industry analysis, and market entry strategies [10]. - Early-stage investments (seed and angel rounds) carry high risks but require thorough evaluation of the team and market potential [10]. - Later stages (A and B rounds) present lower risks with established products and sales channels, making them more attractive for investors [10]. Domestic vs. Foreign Competition - The article highlights the competitive landscape, noting that domestic companies are increasingly positioned to challenge foreign firms in key material sectors [7][8]. - The focus on domestic substitution is critical as China aims to reduce reliance on imports for advanced materials [7][8].