材料汇·2026-01-13 11:56Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific segments such as conductive adhesives are forecasted to reach $3 billion by 2026, while chip bonding materials are estimated to grow from approximately $4.85 billion in 2023 to $6.84 billion by 2029 [8]. Competitive Landscape - Key foreign players in the advanced packaging materials market include Fujifilm, Toray, and Dow, while domestic companies such as 鼎龙股份 (Dinglong Co.), 国风新材 (Guofeng New Materials), and 三月科 (Sanyue Technology) are emerging as significant competitors [8]. - The article lists various advanced packaging materials and their respective market sizes, indicating a competitive landscape where domestic firms are increasingly gaining market share [8]. Investment Strategies - Different investment stages in the new materials industry are outlined, emphasizing the importance of team assessment, industry analysis, and market entry strategies at each phase [10]. - The article suggests that the A-round financing stage presents lower risks and higher returns, as companies at this stage typically have established sales channels and are experiencing rapid growth [10]. Future Trends - The article identifies 14 critical advanced packaging materials that are essential for the semiconductor industry, indicating a significant opportunity for investment and development in these areas [7][8]. - The anticipated growth in the new materials sector is driven by technological advancements and the need for domestic alternatives to imported materials, particularly in high-tech industries [7][8].