材料汇·2026-01-13 11:56Core Viewpoint - Advanced packaging technology is crucial for enhancing semiconductor performance in the post-Moore era, addressing challenges such as storage, area, power, and functionality walls [6][57]. Group 1: Advanced Packaging Concepts - Key technologies in advanced packaging include Bump, RDL, Wafer, and TSV, which are essential for improving chip performance [6]. - The functions of semiconductor packaging can be categorized into mechanical protection, electrical connection, heat dissipation, and mechanical connection [7]. - Advanced packaging aims to connect chips more efficiently and compactly, thereby enhancing overall chip/system performance and functionality compared to traditional packaging [9]. Group 2: Market Trends and Growth - The advanced packaging market is projected to grow at a CAGR of 8.9% from 2019 to 2029, with its share of the packaging industry increasing from 45.6% to 50.9% during the same period [19]. - Traditional packaging remains dominant in terms of unit volume, but advanced packaging is gradually increasing its wafer consumption share [19]. - The fastest-growing segments within advanced packaging are expected to be ED and 2.5D/3D technologies [19]. Group 3: Industry Chain and Key Players - The semiconductor packaging industry consists of upstream materials and equipment, midstream packaging processes, and downstream applications in various sectors such as mobile devices, AI, and automotive electronics [24]. - Major players in the advanced packaging field include TSMC, Intel, and Samsung, with OSAT companies like ASE and Amkor also playing significant roles [26][27]. Group 4: Policy and Support - The Chinese government has introduced various policies to support the development of advanced semiconductor packaging, including funding and tax incentives [30]. - The establishment of the third phase of the National Integrated Circuit Industry Investment Fund, with a registered capital of 344 billion yuan, reflects the government's commitment to this sector [30]. Group 5: Technical Development and Challenges - Advanced packaging technologies are evolving to address issues such as high-speed signal transmission, integration density, cost reduction, and reliability [36]. - The industry faces challenges related to geopolitical tensions and technological bottlenecks, particularly in EDA and IP core areas [31][28]. Group 6: Equipment and Material Focus - Key areas of focus in advanced packaging equipment include semiconductor testing and measurement devices, die bonding equipment, and hybrid bonding technologies [71][76][78]. - ABF substrates are critical materials in advanced packaging, accounting for a significant portion of costs in both low-end and high-end packaging [88].