我国攻克半导体材料世界难题

Core Viewpoint - The article discusses a breakthrough in semiconductor manufacturing that addresses the thermal conductivity issues caused by "island-like" structures between material layers, which have been a significant bottleneck for device performance improvement [2]. Group 1 - The research team from Xi'an University of Electronic Science and Technology, led by Academician Hao Yue and Professor Zhang Jincheng, has successfully transformed rough "island" interfaces into atomically smooth "films," significantly enhancing chip heat dissipation efficiency and device performance [2]. - This innovative achievement provides a "Chinese paradigm" for high-quality integration of semiconductor materials and has been published in prestigious journals such as Nature Communications and Science Advances [2]. - The traditional semiconductor chip's crystal nucleation layer has a rough surface that severely impacts heat dissipation, leading to "thermal bottlenecks" that can degrade chip performance or even damage devices [5]. Group 2 - The team pioneered the "ion implantation-induced nucleation" technology, which converts the random growth process into a precise and controllable uniform growth, resulting in a new structural interface thermal resistance that is only one-third of the traditional value [5]. - The GaN microwave power devices fabricated using this technology achieved output power densities of 42 watts/mm in the X-band and 20 watts/mm in the Ka-band, improving international records by 30%-40% [5]. - This advancement implies that, for the same chip area, detection distances can be significantly increased, and communication base stations can cover greater distances while being more energy-efficient [5].