我国攻克半导体材料世界难题！

Core Viewpoint - The article highlights significant advancements in semiconductor materials and manufacturing technologies, particularly focusing on breakthroughs in heat dissipation and ion implantation techniques that enhance chip performance and manufacturing capabilities [2][4][5]. Group 1: Semiconductor Material Innovations - Researchers from Xi'an University of Electronic Science and Technology have transformed rough "island" interfaces into atomically smooth "films," significantly improving chip heat dissipation efficiency and device performance [2]. - The new structure's thermal resistance is only one-third of that of traditional methods, leading to a 30%-40% increase in output power density for GaN microwave power devices in X-band and Ka-band applications [4]. Group 2: Equipment Manufacturing Breakthroughs - The successful development of China's first series-type high-energy hydrogen ion implanter (POWER-750H) marks a major milestone, achieving international advanced levels in core indicators [5]. - This development signifies China's mastery over the entire R&D chain of series-type high-energy hydrogen ion implanters, addressing a critical bottleneck in power semiconductor manufacturing and enhancing the country's self-sufficiency in key manufacturing equipment [5].