HBM之后，HBF也要来了

Core Viewpoint - The article discusses the rapid commercialization and potential of High Bandwidth Flash (HBF) technology, which is expected to surpass High Bandwidth Memory (HBM) in market size by around 2038 due to increasing demand from AI applications [4]. Group 1: HBF Technology Development - HBF technology, similar in structure to HBM, is being developed by SK Hynix in collaboration with SanDisk, with plans to release the first generation product (HBF1) by the end of this year [4]. - Samsung and SanDisk aim to apply HBF technology in products from Nvidia, AMD, and Google by late 2027 or early 2028, leveraging their experience from HBM development [4]. - HBF is expected to have a storage capacity 8 to 16 times greater than current HBM, potentially expanding GPU storage capacity to 4TB, which is crucial for AI model requirements [6]. Group 2: Industry Capacity Expansion - Micron Technology plans to acquire a wafer fabrication facility in Taiwan for $1.8 billion, intending to increase DRAM production post-transaction completion in the second quarter [5]. - Samsung has increased its wafer production capacity from 20,000 to 50,000 wafers per month, with initial manufacturing set to begin in the second quarter of this year [6]. - The growing demand for AI is driving storage manufacturers to expand their production capabilities to meet the needs of large AI models [5][6].