材料汇·2026-01-21 15:30Core Viewpoint - The article emphasizes the AIPCB wave and highlights the investment opportunities arising from the upgrade of M9 materials, focusing on four main lines of development [1]. Group 1: Low Dielectric Electronic Fabrics - The transition from LDK to second-generation fabrics is underway, with M9 paired with Q fabrics evolving towards third-generation products [17]. - The market for low dielectric electronic fabrics is expected to grow rapidly, driven by AI server demand, with a projected compound annual growth rate of 23.8% from 2024 to 2033 [20][23]. Group 2: Electronic Resins - The use of hydrocarbon resins in M9 is expected to increase significantly, with a ratio of hydrocarbon resins to PPO rising to 2:1, enhancing the value of materials [31][34]. - New types of resins are becoming mainstream, with hydrocarbon resins being the preferred choice for next-generation high-frequency CCLs [31][39]. Group 3: Fillers - The proportion of spherical silica micro-powder in M9 is expected to increase significantly, with high-performance spherical silica micro-powder filling ratios expanding to over 40% [36][40]. - Liquid-phase preparation methods for silica are becoming the industry standard, meeting the requirements for M7 and above [40]. Group 4: Other Upstream PCB Materials - Attention is drawn to electronic-grade fluorinated copper powder and PCB-specific electronic chemicals, which are essential for the upgrade trends in high-end PCBs [3][43]. - The supply of high-end materials, including Low Dk electronic fabrics and HVLP copper foil, is facing shortages, with major manufacturers accelerating production to meet demand [7][29]. Group 5: Market Performance - The demand for high-end CCL driven by AI is accelerating the upgrade of upstream materials, with significant performance improvements observed in various AIPCB sub-sectors since mid-2025 [5][8]. - The average increase in AIPCB sub-sector indices from May to August 2025 shows substantial growth, particularly in electronic fabrics and copper foil [6]. Group 6: Investment Recommendations - Companies to watch include: 1. Low dielectric electronic fabrics: Honghe Technology, Feilihua, Zhongcai Technology [4]. 2. HVLP networks: Gangguan Copper Foil, Rongfu Technology, Longyang Electronics [4]. 3. Electronic resins: Dongcai Technology, Shengnong Group, Hongchang Electronics, Tongzi New Materials [4]. 4. Other upstream materials: Jiangnan New Materials for electronic-grade oxidized copper powder, Tiancheng Technology for PCB-specific electronic chemicals [4].