【点金互动易】HBM+芯片封装，公司参股企业HBM2e已量产，间接持股企业产品主要应用于CPU、 GPU、AI及车载等高算力芯片的封装

Group 1 - The article emphasizes the importance of timely and professional information interpretation in investment decision-making [1] - HBM+ chip packaging company has started mass production of HBM2e and is advancing the tape-out of HBM3/3e, with applications in CPU, GPU, AI, and automotive high-performance chips [1] - PCB products are utilized in humanoid robots and AI servers, with the company achieving delivery and certification of 800G/1.6T optical modules [1]