弯折、拉伸都不怕！我国科学家实现芯片领域新突破

Core Viewpoint - Fudan University has developed a new "fiber chip" that integrates large-scale circuits within elastic polymer fibers, addressing the flexibility challenge in smart devices [1]. Group 1 - The research team led by Peng Huisheng and Chen Peining successfully constructed integrated circuits within elastic fibers, marking a significant advancement in flexible electronics [1]. - The design optimizes space within the fiber, achieving high-density integration in a one-dimensional constrained size [1]. - The team developed a preparation route compatible with current photolithography processes, utilizing plasma etching to achieve a surface roughness below 1 nanometer [1]. Group 2 - A dense polystyrene film layer is deposited on the elastic polymer surface, providing a "flexible armor" for the circuits [1]. - This protective layer effectively resists the polar solvents used in photolithography and buffers the circuit layer against strain, ensuring stability after repeated bending and stretching [1]. - The innovation is expected to pave the way for new integration paths in fiber electronic systems, facilitating advancements in brain-machine interfaces, electronic textiles, and virtual reality [1].