一文详解相变储能材料封装技术研究进展！

Core Viewpoint - Phase Change Materials (PCMs) are materials that store and release energy through phase transitions, effectively regulating temperature and thermal resistance. The encapsulation of PCMs is essential to prevent leakage and enhance thermal conductivity, with various encapsulation methods being explored to improve their performance [1]. Group 1: Encapsulation Methods - Microencapsulated Phase Change Materials (MEPCMs) consist of a core PCM surrounded by a shell made of polymers or inorganic materials, typically ranging from 1 to 1000 μm in size. This structure prevents leakage and increases heat transfer efficiency [2][3]. - The encapsulation structure of MEPCMs is influenced by the type of encapsulation materials and preparation processes, with common organic shell materials including melamine-formaldehyde resin, polyurethane, polystyrene, and polymethyl methacrylate, while silica is a common inorganic shell material [3]. - Various preparation methods for microencapsulation include spray drying, interfacial polymerization, suspension polymerization, emulsion polymerization, coacervation, and sol-gel methods, each with distinct advantages and disadvantages [4][6]. Group 2: Porous Carrier Encapsulation - Porous carrier encapsulation has gained attention due to its ability to enhance thermal conductivity and stability of PCMs. Common porous materials include metal foams, polymer foams, carbon-based materials, and porous ceramics [8][9]. - Direct immersion is a traditional method for encapsulating PCMs in porous materials, utilizing capillary action to fill the pores with molten PCMs. This method has shown promising results in thermal stability and heat capacity [9]. - Vacuum adsorption improves the encapsulation efficiency by removing air and moisture during the process, allowing for better PCM absorption in porous media [10]. Group 3: Advanced Encapsulation Techniques - In situ assembly allows for simultaneous preparation of porous networks and encapsulation, achieving high loading without leakage. This method has demonstrated significant improvements in thermal conductivity [11]. - Physical-chemical encapsulation methods, such as coacervation and sol-gel processes, combine the benefits of physical and chemical methods to achieve a balance between encapsulation rate and stability [11]. - Nanocapsules, with sizes ranging from 1 to 1000 nm, can be produced using similar methods as MEPCMs, offering higher surface area and thermal efficiency [12]. Group 4: Solid-Solid PCMs - Solid-solid PCMs do not leak during phase transitions and exhibit high structural stability, making them suitable for thermal energy storage. Their preparation methods include molecular structure transitions and chemical bonding techniques [17][18]. - Research on metal-based solid-solid PCMs has shown promising results, with materials like Ni-Mn-Ti demonstrating high thermal cycling stability and adjustable phase transition temperatures [18]. Group 5: Industry Events - The third Phase Change Materials Innovation and Application Forum will be held from April 16-18, 2026, in Guangzhou, focusing on academic and industry collaboration to explore the latest advancements in the PCM field [18].