材料汇·2026-02-06 15:54Core Viewpoint - The article emphasizes the increasing demand for ABF (Ajinomoto Build-up Film) substrates driven by advancements in AI, high-performance computing, and other technologies, predicting a supply-demand gap that will worsen over the coming years, with a projected gap of 10% by the second half of 2026 and potentially reaching 42% by 2028 [2][3]. Group 1: ABF Film Overview - ABF film is a critical insulating material used in semiconductor packaging, developed by Ajinomoto, and is essential for high-density interconnections in advanced microprocessors [8][10]. - The film consists of three layers: a supporting medium (PET), ABF resin, and a protective film, with the resin's components significantly affecting its dielectric and thermal properties [10][12]. Group 2: Market Analysis - The global IC packaging substrate market is projected to grow from approximately 96.1 billion yuan in 2024 to 135.0 billion yuan by 2028, with a compound annual growth rate (CAGR) of 8.8% [31]. - The demand for ABF substrates is primarily driven by high-performance computing, 5G communication, and automotive electronics, with the latter two being the fastest-growing markets [27][41]. Group 3: Competitive Landscape - Ajinomoto dominates the ABF film market with over 95% market share, creating a significant barrier for new entrants due to its extensive patent portfolio and established customer relationships [46][48]. - Other companies attempting to enter the market include a few Japanese firms and some Chinese companies, but they lack the market influence of Ajinomoto [46][48]. Group 4: Future Directions and Investment Logic - The article suggests that the ongoing technological upgrades and the shift in demand structure towards AI applications will create long-term growth opportunities in the ABF film market [2][3]. - The need for domestic production of ABF materials in China is highlighted as a strategic move to mitigate supply chain risks and capitalize on the growing market demand [3].