官宣丨FINE2026 AI芯片及功率器件热管理大会暨展览会

Core Viewpoint - The "AI Chip and Power Device Thermal Management Conference and Exhibition" will focus on the engineering challenges of thermal management in high heat flux density scenarios, driven by advancements in AI, electric vehicles, and energy storage systems [3]. Group 1: Event Overview - The event will take place from June 10-12, 2026, at the Shanghai New International Expo Center, covering an area of 50,000 square meters and expecting over 100,000 attendees [5]. - The conference will include over 300 strategic and cutting-edge technology reports, showcasing innovations in AI, intelligent computing, low-altitude economy, aerospace, smart vehicles, and more [18][21]. Group 2: Key Topics and Discussions - Key topics will include high-performance thermal interface materials, diamond and silicon carbide composites, thermal ceramics, and advanced cooling technologies [8]. - Specialized forums will address liquid cooling solutions for data centers, thermal management for power batteries, and energy storage systems [9]. Group 3: Exhibition Highlights - The exhibition will feature five main themes: data center liquid cooling, energy storage and power semiconductor liquid cooling, liquid cooling materials and components, and manufacturing and processing equipment [10]. - Various cooling solutions will be presented, including AI data center systems, power semiconductor modules, and robotics joint modules [10]. Group 4: Organizers and Support - The event is organized by DT New Materials and supported by various associations and institutions, including the China Productivity Promotion Center and the Harbin Institute of Technology Alumni Association [6]. - Media promotion will involve multiple platforms, ensuring broad outreach and engagement [6]. Group 5: Registration and Participation - Early bird registration fees are set at ¥2200 for attendees and ¥1200 for students, with standard fees increasing to ¥3000 and ¥1500 respectively [12]. - The event aims to create a one-stop platform for collaboration, communication, and procurement in the new materials sector [18].