FINE2026 热管理液冷产业大会暨展览会已启动！

Group 1 - The core theme of the event is the rise of China's future industries leading global innovation in new materials, particularly focusing on liquid cooling technology as a solution to high heat density challenges in various sectors such as AI, electric vehicles, and data centers [2][15][19] - The "2026 Thermal Management Liquid Cooling Industry Conference and Exhibition" will take place from June 10-12, 2026, at the Shanghai New International Expo Center, featuring discussions on key technologies and engineering applications in the liquid cooling field [2][3] - The event will include a specialized exhibition area, "FINE2026 Thermal Management Liquid Cooling Board Industry Exhibition," which will gather upstream and downstream resources to meet market demands and promote high-quality development of the liquid cooling industry [2][7] Group 2 - The organizing bodies include DT New Materials, DT Future Industries, and various associations related to new materials and productivity enhancement, indicating a strong collaborative effort in the industry [4] - The conference will feature over 30 specialized vertical forums and more than 300 expert presentations, focusing on cutting-edge technologies and industry trends in sectors such as AI, aerospace, and renewable energy [17][19] - Key topics of discussion will include advanced semiconductor technologies, energy materials, and thermal management solutions, highlighting the importance of these areas in future industrial development [19][26] Group 3 - The event will showcase a wide range of liquid cooling solutions, including AI data centers, power semiconductor modules, and energy storage systems, emphasizing the comprehensive nature of the exhibition [7] - Various types of cooling plates and materials will be presented, such as microchannel cooling plates and advanced thermal interface materials, reflecting the technological advancements in the field [7] - The conference will also address production technologies and equipment, including 3D printing and CNC processing, which are crucial for the manufacturing of new materials and components [7][26] Group 4 - Early bird registration fees for attendees are set at ¥2200 for general participants and ¥1200 for students, with standard fees of ¥3000 and ¥1500 respectively [8] - The event aims to create a one-stop platform for collaboration, communication, and procurement across the entire supply chain of liquid cooling technologies and materials [7][15]