【6月10-12日 上海】FINE2026 AI芯片及功率器件热管理大会暨展览会

Core Viewpoint - The "AI Chip and Power Device Thermal Management Conference and Exhibition" will focus on the engineering challenges of thermal management in high heat flux density scenarios, driven by advancements in AI, electric vehicles, and energy storage systems [3][17]. Group 1: Event Overview - The event will take place from June 10-12, 2026, at the Shanghai New International Expo Center, covering an area of 50,000 square meters and expecting over 100,000 attendees [5][31]. - The conference aims to explore key technological paths and engineering practices related to high-performance thermal management materials, packaging substrates, and liquid cooling technologies [3][20]. Group 2: Topics of Discussion - Key topics include high-performance thermal interface materials, diamond and silicon carbide composites, thermal ceramics, and advanced cooling technologies [7][8]. - Specialized forums will address liquid cooling solutions for data centers, thermal management for power batteries, and energy storage systems [8][20]. Group 3: Exhibition Highlights - The exhibition will feature five major themes: data center liquid cooling, energy battery and storage liquid cooling, power semiconductor liquid cooling, liquid cooling materials and components, and manufacturing and processing equipment [9][10]. - Various cooling solutions and components will be showcased, including microchannel cooling plates, liquid cooling systems, and advanced manufacturing technologies [9][10]. Group 4: Organizing Institutions - The event is organized by DT New Materials, DT Future Industries, and Insight Thermal Management, with support from various industry associations and academic institutions [5][17]. - The conference will also include over 300 strategic and cutting-edge technology reports, focusing on the latest innovations in AI, aerospace, smart vehicles, and renewable energy [20][22].