【6月10-12日 上海】FINE2026 AI芯片及功率器件热管理大会暨展览会

Core Viewpoint - The "AI Chip and Power Device Thermal Management Conference and Exhibition" will focus on the engineering challenges of thermal management in high heat flux density scenarios, driven by the rapid development of emerging industries such as AI, electric vehicles, and energy storage systems [3][17]. Group 1: Event Overview - The event will take place from June 10 to June 12, 2026, at the Shanghai New International Expo Center, covering an area of 50,000 square meters and expecting over 100,000 attendees [5][31]. - The conference aims to explore key technological paths and engineering practices in thermal management systems, including high-performance thermal interface materials, packaging substrates, and liquid cooling technologies [3][9]. Group 2: Topics of Discussion - Key topics include high-performance thermal interface materials (liquid metals, graphene pads, diamond pads, phase change materials, thermal adhesives), diamond and silicon carbide composites, and thermal ceramics [7]. - Specialized forums will address liquid cooling in data centers, thermal management for power batteries, energy storage, and humanoid robots [8][20]. Group 3: Exhibition Highlights - The exhibition will feature five major themes: data center liquid cooling, energy battery and storage liquid cooling, power semiconductor liquid cooling, liquid cooling materials and components, and manufacturing and processing equipment [9][10]. - Solutions for AI data centers, power semiconductor modules, and robotics will be showcased, along with various cooling plate designs and advanced manufacturing techniques [9][10]. Group 4: Supporting Organizations - The event is organized by multiple entities, including DT New Materials, the New Materials Professional Committee of the China Productivity Promotion Center Association, and various industry associations [5][17]. - Numerous media outlets will promote the event, ensuring broad visibility and engagement within the industry [5]. Group 5: Registration and Participation - Early bird registration fees are set at ¥2200 for representatives and ¥1200 for students, with standard fees of ¥3000 and ¥1500 respectively [11]. - The event will feature over 300 strategic and cutting-edge technology reports, providing a platform for knowledge sharing and networking [20][22].