雷军在发布会上强调，玄戒O1从立项之初就确立了"对标苹果"的目标，手机要对标苹果，芯片也要试一试。 玄戒O1的核心配置堪称豪华，采用台积电第二代3nm技术，晶体管数量达190亿，芯片面积仅109mm²，能效比提升显著。 CPU架构采用创新性设计，采用"2+4+2+2"四簇十核架构，包括2颗3.9GHz超大核、4颗3.4GHz性能大核、2颗1.9GHz能效核及2颗1.8GHz超级能效核，兼顾 高性能与低功耗场景。 GPU采用16核心设计，搭载最新Immortalis-G925，配备GPU动态性能调度技术，功耗大幅降低，拥有相当出色的图形处理性能。 在5月22日晚举行的小米15周年战略新品发布会上，小米带来了一款全新自研的手机SoC芯片玄戒O1，这是继2017年澎湃S1亮相后，蛰伏8年的回归之作。 这次小米玄戒O1的亮相，早已不是8年前的试水行动，而是一次筹备长达4年的计划，最终的成果自然也是惊艳全网，举国沸腾。 据介绍，小米15S Pro在日常应用上，对比iPhone 16 Pro Max的启动响应时间耗时缩短30.4%，在游戏发热上，帧率更高、温度更低。 现在玄戒O1的实验室安兔兔综合成绩也已经公布了，超过3 ...

证券代码：872925 证券简称：锦好医疗 公告编号：2025-049 惠州市锦好医疗科技股份有限公司 投资者关系活动记录表 本公司及董事会全体成员保证公告内容的真实、准确和完整，没有虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连 带法律责任。 一、 投资者关系活动类别 □特定对象调研 √业绩说明会 □媒体采访 □现场参观 □新闻发布会 □分析师会议 □路演活动 □其他 二、 投资者关系活动情况 参会单位及人员：通过网络方式参加 2024 年年度报告业绩说明会的投资者。 上市公司接待人员： 董事长：王敏先生； 董事、财务总监：彭月初先生； 董事会秘书：段皓龄先生； 保荐代表人：张亮先生。 三、 投资者关系活动主要内容 公司在本次业绩说明会上就投资者关心的问题进行了回答，主要的问题及回 答情况如下： 问题一：请问公司具备哪些资质认证，能否满足客户需求？ 活动时间：2025 年 5 月 20 日 活动地点： 公 司 通 过 网 络 远 程 的 方 式 在 中 证 网 " 中 证 路 演 中 心 " （https://www.cs.com.cn/roadshow/）举办 2024 ...

小米集团-W(01810) 报告日期：2025 年 05 月 22 日 小米战略新品发布会前瞻 ——小米集团点评报告 本次发布会手机芯片 SoC 芯片玄戒 o1 将亮相，小米成为继苹果、高通、联发科 后全球第四家发布自主研发设计 3nm 制程手机芯片的企业。雷军在官方微博中 提及，小米从 2014 年开启手机芯片研发之旅，期间小芯片陆续面世，如快充芯 片、电池管理芯片、影像芯片、天线增强芯片等，并于 2021 年重新开始研发 SoC，并制定了至少投入 10 年，至少投资 500 亿的长期计划。截至 25 年 4 月底 玄戒累计研发投入已经超过 135 亿人民币，预计 25 年研发投入超过 60 亿，研发 团队超过 2500 人。 ❑ 将发布小米 15S Pro，搭载玄戒 o1，产品体验值得期待，也为小米产品在 AI 时 代保持竞争力提供基础。 我们能从苹果和华为的案例看到，搭载自研芯片+OS 的产品能带来差异化的产品 体验，并提升品牌价值。在"小米终端+玄戒 SoC+澎湃 OS+MiMo 推理模型"的 全自研产品矩阵下，可以期待 15S Pro 带来超预期的产品体验和销量。 ❑ YU7 发布会有望开启小订，时 ...

小米集团-W(01810) 报告日期：2025 年 05 月 22 日 小米战略新品发布会前瞻 ——小米集团点评报告 投资要点 财务摘要 | [单位Table_Forcast] /百万 | 2024A | 2025E | 2026E | 2027E | | --- | --- | --- | --- | --- | | 营业收入 | 365906 | 481844 | 636475 | 716471 | | (+/-) (%) | 35% | 32% | 32% | 13% | | 归母净利润 | 23658 | 32198 | 51439 | 55423 | | (+/-) (%) | 35% | 36% | 60% | 8% | | 每股收益(元) | 0.95 | 1.24 | 1.98 | 2.14 | | P/E | 33.59 | 40.59 | 25.41 | 23.58 | 资料来源：浙商证券研究所 本次发布会手机芯片 SoC 芯片玄戒 o1 将亮相，小米成为继苹果、高通、联发科 后全球第四家发布自主研发设计 3nm 制程手机芯片的企业。雷军在官方微博中 提及，小米从 2014 年开启手机芯片 ...

以下文章来源于晚点Auto ，作者晚点团队 晚点Auto . 从制造到创造，从不可能到可能。《晚点LatePost》旗下汽车品牌。 毛利率增长、净亏损收窄，小鹏稳住基本盘，迎接下半年更大挑战。 文 丨 赵宇 编辑 丨 龚方毅 "很多人都在好奇，小鹏一季度业绩表现不错的原因。核心在于我们在产品、营销、技术和经营上体系 化能力的综合提高。" 小鹏汽车 CEO 何小鹏在 5 月 21 日晚的电话会上说。 今年前 3 个月，小鹏净亏损收窄至 6.6 亿元，同、环比均下降超过 50%，自由现金流超 30 亿元。积 极因素包括新品车型销量增长、毛利率提升、大众技术研发合作深化，以及销售、管理和研发费用率 展望二季度，小鹏预计交付量会继续增长，达到 10.2 万至 10.8 万辆；营收 175 亿至 187 亿元，同比 增长约 115.7% 至 130.5%，均好于华尔街预期。何小鹏表示，小鹏有信心达成全年销量翻倍以上的增 长目标，并且还将按计划在四季度盈利，实现全年规模化的自由现金流。 受业绩利好指引和超预期的业绩驱动，小鹏今晚美股盘中涨幅一度接近 15%。 何小鹏说公司在未来几个季度将保持增长势头，核心在于新产品的持续 ...

Core Viewpoint - The competition in the smartphone chip market is intensifying, with Qualcomm and MediaTek dominating the landscape, while domestic smartphone manufacturers face challenges in adopting self-developed chips for overseas markets [1][3][5]. Group 1: Market Dynamics - The smartphone chip market is primarily controlled by Qualcomm and MediaTek, with both companies emphasizing differentiation to maintain their market share [3]. - Qualcomm's self-developed GPU gives it an edge in the high-end smartphone chip market, allowing it to outperform MediaTek despite both using ARM's public core [3]. - Samsung has reduced its reliance on self-developed chips and increased its procurement of Qualcomm chips, contributing over 40% of Qualcomm's revenue [3]. Group 2: Challenges for Domestic Manufacturers - Domestic smartphone manufacturers struggle to compete with Qualcomm in overseas markets due to the performance limitations of their self-developed chips, which mostly use ARM's public core [5]. - Patent issues pose significant challenges for domestic brands, as they have faced multiple lawsuits to establish their patent positions, making them cautious in overseas markets [5][6]. - The strict intellectual property management in Europe further complicates the situation for domestic manufacturers, leading them to prefer Qualcomm chips for their European sales [6][8]. Group 3: Strategic Decisions - Domestic smartphone brands often use both Qualcomm and MediaTek chips, but prioritize Qualcomm for European markets while using MediaTek for emerging markets [6]. - The choice of chip is influenced by various factors beyond technology, including legal and market considerations, which companies must carefully evaluate [8].

从技术参数来看，"玄戒 O1" 采用第二代 3nm 工艺制程，晶体管数量高达 190 亿颗。其 CPU 为 "1+3+4" 八核三丛集设计（ Cortex-X4 超大核 +A720 中核 +A520 能效核）， GPU 性能对标骁龙 8Gen3 ，安兔兔跑分高达 192 万 + ， AI 算力达 40TOPS 。 Geekbench6 测试数据显示，该芯片单核成绩 3119 分、多核成绩达 9673 分，性能表现十 分亮眼。 国金证券指出，芯片自研是小米冲击高端化战略的关键一环，有助于实现硬件与软件的深度 协同，提升手机的差异化竞争力。玄戒 O1 的推出，使小米成为全球第四家、国内第二家具 备自研 SoC 能力的手机厂商，填补了国内 5nm 以下先进制程设计的空白，对国内芯片产业 的发展具有重要的示范意义。然而，芯片研发后续仍面临诸多挑战，如技术的持续迭代升 级、大规模量产过程中的良品率提升以及成本控制等问题，小米需要在这些方面持续发力， 才能在激烈的市场竞争中站稳脚跟。 // 小米 15S Pro // 作为 " 玄戒 O1" 的首发机型，小米 15S Pro 备受期待。目前已知信息显示，小米 15S Pr ...

Core Viewpoint - Xiaomi's self-developed 3nm smartphone SoC, "Xuanjie O1," is set to be officially released on May 22, marking a significant milestone in the company's decade-long chip development journey. This positions Xiaomi as the fourth company globally to design its own 3nm smartphone SoC, following Apple, Qualcomm, and MediaTek [2][4]. Chip Development and Market Position - The Xuanjie O1 is primarily aimed at high-end flagship products, with initial production estimates conservatively set at several hundred thousand units due to high initial costs from small-scale production [2][4]. - Xiaomi's strategy includes using a self-developed application processor (AP) while likely relying on MediaTek for the baseband processor (BP), as developing a proprietary BP involves high patent costs and complex compatibility challenges [6][8]. Competitive Landscape - Xiaomi aims to enhance its position in the high-end smartphone market, where competitors like Apple, Samsung, and Huawei already utilize self-developed SoCs. The self-developed SoC is seen as crucial for differentiation, cost control, and energy optimization [8][9]. - As of March 2024, Xiaomi holds a 24.3% market share in the 4000-5000 yuan price segment in mainland China, indicating progress in its high-end market strategy [8]. Relationship with Third-Party Suppliers - Despite the introduction of its own chip, Xiaomi will continue to collaborate with Qualcomm and MediaTek for various product lines, as the self-developed chip requires multiple generations for market validation and cost optimization [10][11]. - Qualcomm's CEO has stated that Xiaomi's self-developed chip is not expected to impact its business, and both companies have reaffirmed their partnership through a multi-year agreement [11]. Investment and Development History - Xiaomi has invested over 13.5 billion yuan in chip development from 2021 to April 2025, with an expected investment of over 6 billion yuan in 2023 alone. The R&D team has grown to over 2,500 members [12][13].

Core Insights - Xiaomi's self-developed SoC chip, "Xuanjie O1," is set to be released soon, marking a significant step in the company's chip development journey [1][3] - The chip has achieved mass production using advanced 3nm process technology, positioning Xiaomi among the top four companies globally to release such a chip [3][5] - Xiaomi's substantial investment in chip R&D, exceeding 135 billion yuan, highlights its commitment to advancing semiconductor technology in China [4][11] Investment and Market Impact - Following the announcement of the Xuanjie O1, Xiaomi's stock experienced notable movements in both Hong Kong and A-share markets [2] - The chip's performance metrics, with single-core scores of 2709 and multi-core scores of 8125, indicate competitive capabilities against Qualcomm's Snapdragon 8 Gen 3 [5][12] - Xiaomi's strategy includes leveraging self-developed chips to enhance its ecosystem, potentially linking smartphones with smart home products and electric vehicles [10][11] Industry Position and Future Outlook - Xiaomi is recognized as the second Chinese manufacturer after Huawei to achieve mass production of flagship SoC chips [5] - The company ranks among the top three in terms of R&D investment and team size in the domestic semiconductor design sector [4] - Despite advancements, challenges remain in developing integrated baseband chips, with Xiaomi expected to continue using third-party solutions in the near term [6][9] Competitive Landscape - Qualcomm's CEO stated that Xiaomi's self-developed chips are not expected to disrupt Qualcomm's business, as the latter will continue to supply chips for Xiaomi's flagship devices [5] - The collaboration between Xiaomi and Qualcomm is set to continue, with plans to advance AI edge devices together [5][9] - The competitive landscape in the smartphone market shows Xiaomi regaining its position as a leader, with a 19% market share in Q1 2025 [12]

作者｜Hayward 原创首发｜蓝字计划 过去两个月，堪称小米造车一年以来的至暗时刻。 3 月小米 SU7 高速事故、4 月底 5 月初小米 SU7 Ultra 限制马力被车主投诉，再到4.2 万的挖孔碳纤维机盖被指虚假宣传，部分车主要求退车甚至"假一赔 三"… 甚至小米的手机旗舰，小米 15 Ultra，被其他 Ultra 的轮番冲击下，也没有了年初"影像超大杯"的独特性。 与此同时，大家发现雷军变了。他不再像过去那样继续扮演"许愿池"的角色，没有往日的"真诚"，这两个月发生的林林总总，全都没有回应。 这种风格的转变，实际上代表了现阶段小米的新选择：不再打"真诚"、"走心"的温情牌，而是选择"用产品的热度压过质疑"。 也就是说，对于舆论的种种诉求和期待，小米选择了战略上的忽略与漠视。 你们觉得雷军应该回应、应该反省、应该为挖孔前机盖事件的虚假宣传道歉？那都是你的事了。 随后，小米的最强反击来了。5 月 19 日，小米官宣将在 22 日召开15 周年战略新品发布会；率先掏出来的，是小米核弹级别的新品：自研芯片玄戒 O1。 但是选择和放弃之间是有代价的，更大的风险，或也在悄然酝酿。 小米「核弹」 5 月 19 ...