Core Viewpoint - The corn industry is a strategic pillar for China's food security, with significant growth in planting area, yield, and total production expected in 2024, despite short-term market adjustments due to international price fluctuations and rising costs [1][8][14]. Group 1: Industry Overview - The corn processing industry in China has developed a complete industrial chain, from primary processing to modern biobased material research, becoming a key hub for agricultural production and industrial manufacturing [1][5][14]. - Corn processing can be categorized into primary processing and deep processing, producing various products for food, feed, and industrial applications [2][3][5]. Group 2: Current Development Status - In 2024, China's corn planting area is projected to reach 44.74 million hectares, a year-on-year increase of 1.18%, with a yield of 439.4 kg/mu, contributing to a total production of 294.92 million tons, a 2.1% increase from the previous year [1][8][10]. - The total corn consumption in 2024 is expected to reach 31.78 million tons, with industrial consumption growing by 3.07% to 7.94 million tons, driven by innovations in deep processing [12][14]. Group 3: Market Trends - The corn deep processing market size is expected to adjust to 190 billion yuan in 2024, down 6.4% from its peak in 2022, but the long-term growth trend remains solid [1][14]. - The corn processing industry is transitioning towards green and low-carbon practices, focusing on high-value product development such as polylactic acid and functional sugars [24][25][26]. Group 4: Competitive Landscape - The corn deep processing industry in China has a tiered competitive structure, with leading companies like COFCO Technology and Meihua Biological occupying the top tier, focusing on high-value products [20][22]. - The market for corn starch is highly concentrated, with top companies holding over 44% market share, and there is a trend towards differentiation and expansion into biobased materials and other emerging fields [22][24].

Group 1 - New Asia Electronics (605277) has seen a strong performance in the stock market, reaching a limit-up price of 18.46 yuan per share [1] - The company has developed a new high-speed copper cable manufacturing technology called "lotus core high-speed wire" in collaboration with Amphenol, which has received patent authorization and is now in mass production [1][2] - The lotus core structure technology allows for the production of high-quality, high-performance high-speed copper cables without the need for imported fluoropolymer foaming equipment, addressing limitations in the current manufacturing process [1][2] Group 2 - The demand for high-speed copper cables is increasing rapidly due to the growth of data centers, and the lotus core structure is expected to become a mainstream technology solution beyond traditional foaming methods [2] - New Asia Electronics was established in 1987 and focuses on the research and manufacturing of electronic cables, with a diverse product range including precision electronics, communication optical cables, and cables for electric vehicles [3] - The company has obtained a total of 31 authorized invention patents and 164 utility model patents, serving well-known clients such as Hisense, Gree, Midea, BYD, Dell, and HP [3]

Core Viewpoint - Intel's new CEO, Lip-Bu Tan, is considering significant changes to the company's contract manufacturing business to attract major clients, which may incur high costs compared to previous plans [1][2]. Group 1: Strategic Changes - The new strategy for Intel's contract manufacturing will not include marketing certain long-developed chip manufacturing technologies to external clients [1]. - Intel's 18A process, which has seen substantial investment, is reportedly losing appeal to new customers, prompting the need for potential write-downs [1][2]. - The company is focusing more resources on the 14A process, which is expected to be more competitive than TSMC's N2 technology, aiming to attract major clients like Apple and Nvidia [2]. Group 2: Financial Implications - Intel is projected to incur losses of up to $18.8 billion in 2024, marking its first loss since 1986 [3]. - The potential costs associated with the shift in strategy could lead to losses in the hundreds of millions or even billions of dollars [1][2]. Group 3: Production Plans - Intel plans to achieve mass production of the 18A chips later this year, with internal chips expected to be delivered ahead of external customer orders [4]. - The timely delivery of 14A chips to secure large contracts remains uncertain, and Intel may continue with its existing 18A chip plans [4][5].

Group 1 - The core viewpoint of the article is that China is projected to become the largest semiconductor production center, holding 30% of global foundry capacity by 2030, surpassing Taiwan's current 23% [1][2] - China's semiconductor production is expected to reach 8.85 million wafers per month in 2024, a 15% increase from the previous year, and is projected to grow to 10.1 million wafers by 2025 [1] - The Chinese government is heavily investing in domestic semiconductor manufacturing to achieve self-sufficiency, which includes the construction of 18 new wafer fabs [1] Group 2 - The United States is the largest consumer of wafers, accounting for approximately 57% of global demand, but only has about 10% of global production capacity [2] - Other regions like Japan and Europe are meeting their domestic wafer needs, while Singapore and Malaysia account for about 6% of global foundry capacity, primarily serving the needs of the US and China [2] - The report does not account for the ongoing construction of wafer fabs in the US, including significant projects by TSMC, Intel, and others, which will increase US production capacity [2] Group 3 - The article highlights that despite China's potential production capacity, the technological capabilities of its fabs compared to Western counterparts remain uncertain due to US export controls on advanced chip manufacturing technology [2] - China is investing billions to fill gaps in its semiconductor industry, particularly in areas like lithography tools and electronic design automation (EDA) software [2]

Core Insights - The "2025 International Conference on Green Materials and Manufacturing Technology" (GMMT 2025) was successfully held at the University of Cambridge, focusing on advancements in green materials and sustainable manufacturing technologies [2] - The conference aimed to address environmental and resource challenges, promoting international cooperation and exchange in the field of green and low-carbon development [2] Group 1: Key Presentations - Keynote speakers included Sir Harry Bhadeshia from Queen Mary University of London discussing emission reduction pathways in the steel industry, and Professor Vasant Kumar from Cambridge University analyzing the prospects of the hydrogen economy [3] - Professor Ali Kamali from Northeastern University presented innovative applications of molten salt technology in green material synthesis and waste recycling [3] - Professor S. Ravi P. Silva from Surrey University emphasized the critical role of advanced materials in achieving net-zero goals, while Professor Nguyen Thi Kim Thanh from University College London shared cutting-edge results on nanoparticles in biomedical applications [3] Group 2: Roundtable Discussions - Experts, including Professor Li Xinyong from Dalian University of Technology and Ingo Gustav Wender, founder of a Brazilian advanced potassium fertilizer company, discussed key issues such as policy support, intellectual property protection, and commercialization challenges in green technology transfer [7] - The discussions aimed to provide constructive suggestions for collaborative innovation between academia and industry [7] Group 3: Conference Outcomes - The conference facilitated high-level interdisciplinary dialogue, exploring development paths for green materials and manufacturing technologies [10] - It helped to consolidate international consensus and identified three key action directions: material innovation, process upgrading, and global collaboration [10] - GMMT 2025's success is seen as a catalyst for accelerating global green transformation and establishing a more solid foundation for cooperation [10]

如果您希望可以时常见面，欢迎标星收藏哦~ 领 先 的 晶 圆 代 工 厂 和 IDM 厂 商 正 朝 着 2 纳 米 （ 或 同 等 ） 技 术 节 点 的 量 产 迈 进 ， 其 中 环 栅 （GAA）纳米片晶体管将发挥核心作用。GAA纳米片器件架构作为FinFET技术的后继者， 旨在进一步缩小SRAM和逻辑标准单元的尺寸。 GAA 纳米片器件的主要特点是垂直堆叠两个或多个纳米片状导电沟道，每个逻辑标准单元包含一 个堆叠用于 p 型器件，另一个堆叠用于 n 型器件。这种配置允许设计人员进一步缩小逻辑标准单 元高度，其定义为每个单元的金属线（或轨道）数量乘以金属间距。设计人员还可以选择加宽沟 道，以牺牲单元高度为代价换取更大的驱动电流。除了面积缩小之外，GAA 纳米片晶体管相比 FinFET 还具有另一个优势：栅极从各个方向包围导电通道，即使在较短的通道长度下也能增强栅 极对通道的控制。 在芯片制造商过渡到CFET（complementary FET ）技术之前， GAA 纳米片技术预计将持续至少 三代技术。 由于其 nMOS-pMOS 垂直堆叠结构， CFET 的集成复杂度显著高于常规纳米片器件。根据 im ...

中共中央政治局常委、国务院总理李强6月16日至18日在江苏调研。他强调，要深入贯彻习近平总书记关于做 好经济工作的重要指示精神，坚持创新驱动发展，着力扩大有效需求，进一步营造干事创业浓厚氛围，在深化 改革开放中激发高质量发展动力活力，推动经济运行持续向好。 李强先后来到徐州市、南京市，走进企业、科研院所、工程现场、贸易合作平台等，深入了解经济运行情况。 在江苏汇智高端工程机械创新中心有限公司，李强听取实验项目等汇报，察看核心零部件和产品。他指出，工 程机械行业高端化、智能化、绿色化发展是大势所趋。要对标国际先进水平，积极运用人工智能、清洁能源等 技术，推动产业转型升级。要聚合行业资源，搭建大中小企业协同创新平台，促进企业优势互补、相互赋能。 在深地科学与工程云龙湖实验室，李强听取相关技术装备研发进展等介绍，希望大家把科技创新和产业需求有 效结合，推进重大原始创新和技术突破，加快产业化落地和市场应用推广。在南京原子制造研究所，李强了解 原子级制造技术发展等情况，勉励他们锚定新领域新赛道，加强前瞻性布局，深入开展基础研究，推动跨学科 交叉融合创新和开放合作，抢占未来科技和产业发展制高点。 李强来到南京北站项目现场 ...

随着半导体先进封装与FPD制造技术的不断演进，洁净室自动化生产设备面临的静电问题 日益严峻。为帮助行业同仁深入了解静电带来的潜在风险，并探索高效可靠的解决方案， 提升产能和良率， 戈尔诚邀您参与6月26日举办的半导体及FPD设备静电解决方案专题研 讨会 。 户经验,还曾负责东南亚市场,对国 内外大客户的设备及应用需求有深 入了解。 同 核心内容提要 本次研讨会将 聚焦于洁净室环境中静电控制的关键技术 ，分享前沿解决方案与真实应用案例， 助力您提升设备可靠性与产能表现。 > 痛点直击:半导体先进封装中的静电问题及风险 技术革新:戈尔新一代电缆技术:防止静电积聚, 提升可靠性和产效 全球案例: 1.全球知名先进封装设备商应用案例分析 2.全球知名FPD制造商在OLED设备为什么采用 抗静电电缆? ● Q&A环节:戈尔经验丰富的技术团队在线答疑 解惑。 Together, improving life 扫描下方二维码预约报名 即可激活抽奖资格 扫码立即锁定席位 倒计时提示 ⏳ 席位有限！ 6月26日前预约有效 （本文图源：戈尔） *免责声明：本文由作者原创。文章内容系作者个人观点，半导体行业观察转载仅为了传达一种不 ...

浙江师范大学 胡仲略 副教授 将在 6.19（周四） 晚上， 19:00-20:00 ，为大家分享 《螺杆挤出式 增材制造技术研究前沿与进展》 的线上课程，欢迎大家扫码联系免费观看！ 欢迎扫码进群观看 3D 打印碳纤维增强聚合物复合材料的力学性能在工程应用中至关重要，但通过材料挤压制备高性能 复合材料仍面临挑战。 熔丝制造基于细丝挤出的本质，其挤丝速度慢以及打印PEEK-CF样品的强度相对较低，已成为大规 模运用的主要障碍。但基于 螺杆挤出的增材制造（SEAM） ，相比于传统的FFF工艺（材料挤 出），它准许更高的增强材料负载以及拥有更高的挤丝速度。 浙江师范大学的胡仲略副教授 ，在其 研究成果中曾公开了一种 使用定制的螺杆挤出3D打印机直接打印高含量的颗粒状碳纤维填充聚醚醚 酮-碳纤维复合材料（含有高达 30 wt% CF） 的方法。 该研究通过一台自设计的 螺杆挤出3D打印机 成功打印出了含有高达 30 wt% 碳 纤 维 的 高 强 度 PEEK-CF复合颗粒 ，且有以下特点： （1）PEEK-30CF的拉伸强度达到 190.5 MPa ，这一数值是未填充PEEK（92.8 MPa）的两倍多。 （2）打 ...

深耕神外赛道，脑膜胶和可吸收止血纱新品上量可期 [Table_CoverStock] —迈普医学(301033)公司深度报告 [Table_ReportDate] 2025 年 6 月 16 日 证券研究报告 公司研究 [Table_ReportType] 公司深度报告 [Table_StockAndRank] 迈普医学(301033) [Table_CoverAuthor] 唐爱金 医药行业首席分析师 曹佳琳 医药行业分析师 S1500523080002 S1500523080011 tangaijin@cindasc.com caojialin@cindasc.com [Table_CoverReportList] 相关研究 1.集采助力产品放量，盈利能力逐步增强 2.集采压力期已过，国内海外双丰收 投资评级 买入 上次评级 [Table_BaseData] 公司主要数据 | [Table_Profit] 重要财务指标 | 2023A | 2024A | 2025E | 2026E | 2027E | | --- | --- | --- | --- | --- | --- | | 营业总收入(百万元) | ...