证券代码：002639 证券简称：雪人股份 福建雪人集团股份有限公司投资者关系活动记录表 | | □ 特定对象调研 □ 分析师会议 | | --- | --- | | 投资者关系 | □ 媒体采访 □ 业绩说明会 | | 活动类别 | □ 新闻发布会 □ 路演活动 | | | 其他：线上、线下调研 □ 现场参观 ■ 中国国际金融股份有限公司、东兴证券股份有限公司、东北证券股份有 | | | 限公司、招商基金管理有限公司、中金基金管理有限公司、上海峰境私 募基金管理有限公司、中信证券股份有限公司、国海证券股份有限公司、 | | | 广发证券股份有限公司、山西证券股份有限公司、华泰证券股份有限公 | | 参与人员 | 司、国金证券股份有限公司、太平洋证券股份有限公司、招商证券股份 | | | 有限公司、浙商证券股份有限公司、国联证券股份有限公司、耕霁(上 | | | 海)投资管理有限公司、上海申银万国证券研究所有限公司、深圳市辰 | | | 禾投资有限公司（以上排名不分先后） | | 时间 | 2025 年 5 月 15 日 (周四) 上午 10:00~11:00 | | 地点 | 网络互动 | | | 总经理 ...

天眼查资料显示，中汽院（重庆）汽车检测有限公司，成立于2020年，位于重庆市，是一家以从事专业 技术服务业为主的企业。企业注册资本2000万人民币。通过天眼查大数据分析，中汽院（重庆）汽车检 测有限公司参与招投标项目187次，专利信息101条，此外企业还拥有行政许可11个。 中国汽车工程研究院股份有限公司，成立于2001年，位于重庆市，是一家以从事专业技术服务业为主的 企业。企业注册资本100418.0587万人民币。通过天眼查大数据分析，中国汽车工程研究院股份有限公 司共对外投资了34家企业，参与招投标项目5000次，财产线索方面有商标信息377条，专利信息1780 条，此外企业还拥有行政许可97个。 金融界 2025 年 5 月 13 日消息，国家知识产权局信息显示，中汽院（重庆）汽车检测有限公司、中国汽 车工程研究院股份有限公司取得一项名为"一种汽车底护板总成"的专利，授权公告号 CN222845263U， 申请日期为 2024 年 8 月。 专利摘要显示，本实用新型涉及汽车底护板领域，具体公开了一种汽车底护板总成。包括底护板本体， 底护板本体内设有导风内槽，底护板本体侧壁设有均与导风内槽连通的进风口和 ...

证券代码：836871 证券简称：派特尔 公告编号：2025-038 珠海市派特尔科技股份有限公司 投资者关系活动记录表 本次业绩说明会公司就投资者普遍关注的问题进行了沟通与交流，主要问题 及回复如下： 本公司及董事会全体成员保证公告内容的真实、准确和完整，没有虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连 带法律责任。 上市公司接待人员：1、派特尔董事长、总经理陈宇 2、派特尔董事会秘书、 财务总监赵伟才 3、保荐代表人：谢德泳 一、 投资者关系活动类别 三、 投资者关系活动主要内容 □特定对象调研 √业绩说明会 □媒体采访 □现场参观 □新闻发布会 □分析师会议 □路演活动 □其他 二、 投资者关系活动情况 活动时间：2025 年 5 月 8 日 活动地点：珠海市派特尔科科技股份有限公司（以下简称"公司"）通过全景 网"投资者关系互动平台"（https://ir.p5w.net）采用网络远程的方式召开 2024 年 年度报告业绩说明会。 参会单位及人员：通过网络方式参加公司本次业绩说明会的投资者。 1、能否详细介绍 2024 年公司在产品研发方面取得的进展？这些研发成果 ...

| 投 资 者 关 系 活 | □特定对象调研 □分析师会议 | | --- | --- | | | □媒体采访 ☑业绩说明会 | | 动类别 | □新闻发布会 □路演活动 | | | □现场参观 | | | □其他 （请文字说明其他活动内容） | | 参 与 单 位 名 称 | 部分投资者 | | 及人员姓名 | | | 时间 | 2025 年 5 月 8 日下午 15:00-16:00 | | 地点 | 网络方式 | | 上 市 公 司 接 待 | 公司董事长、总经理 王雪颖女士 | | 人员姓名 | 公司董事、董事会秘书、副总经理 周辉先生 | | | 公司副总经理 李旭斌先生 | | | 公司董事、财务总监 汪建华先生 | | | 公司独立董事 邓博夫先生 | | | 1.请问贵公司与成飞集团是否有业务往来 | | | 答：谢谢您对公司的关注。公司目前不是成飞集团的直接供应商，仅为其直接 | | | 供应商的配套供应商。 | | | 2.请问公司目前一体成型电感的进展如何了？ | | | 答：谢谢您对公司的关注。公司可提供多种规格的一体成型电感，该类产品采 | | | 用金属粉末压铸而成，具有大电流、 ...

Core Viewpoint - The company has demonstrated significant growth in revenue and profit in 2024 and Q1 2025, driven by increased demand in the consumer electronics sector and strategic expansion into new markets and product lines [1][2]. Financial Performance - In 2024, the company achieved a revenue of 1.566 billion yuan, a year-on-year increase of 24.51% - The net profit attributable to shareholders reached 201 million yuan, up 173.04% - The net profit after deducting non-recurring items was 174 million yuan, growing by 228.14% - For Q1 2025, the company reported a revenue of 349 million yuan, a 16.41% increase year-on-year - The net profit attributable to shareholders was 62 million yuan, up 105.70% - The net profit after deducting non-recurring items was 56 million yuan, increasing by 214.99% [1]. Industry Trends and Developments - The consumer electronics industry is experiencing a recovery, with the company expanding its business beyond mobile phones to other terminal products in North America - The demand for new cooling solutions is rising due to AI-driven product iterations in consumer electronics and digital infrastructure [2]. - The company has strengthened its position in the artificial synthetic graphite materials sector and is enhancing its market share in die-cut components [3]. Strategic Initiatives - The company is actively pursuing industry solutions and core materials for computing power devices, creating new growth avenues - It has achieved product certification and mass production for its integrated VC module products in the data center communication sector [3]. - The company is expanding its international presence, establishing Singapore as its overseas headquarters and Thailand as a production base [3]. Profitability and Investment Outlook - The company has maintained a gross margin of 30.95% in 2024, an increase of 5.84 percentage points year-on-year - The net profit margin reached 12.80%, up 7.08 percentage points year-on-year - The company is expected to see continued profit growth, with projected net profits of 266 million, 320 million, and 373 million yuan for 2025-2027, respectively [2][4].

2025 年 05 月 05 日 业绩表现抢眼，新业务增长强劲 买入(维持) 事件 分析师：黎江涛 S1050521120002 lijt@cfsc.com.cn | 基本数据 | 2025-04-30 | | --- | --- | | 当前股价（元） | 71.4 | | 总市值（亿元） | 53 | | 总股本（百万股） | 74 | | 流通股本（百万股） | 29 | | 52 周价格范围（元） | 35.35-93.98 | | 日均成交额（百万元） | 205.24 | 市场表现 -50 0 50 100 150 (%) 强瑞技术 沪深300 资料来源：Wind，华鑫证券研究 相关研究 1、《强瑞技术（301128）：业绩表 现抢眼，新业务持续发力》2024- 09-01 2、《强瑞技术（301128）：治具及 设备构筑基本盘，液冷打造第二成 长极》2023-05-10 —强瑞技术（301128.SZ）公司事件点评报告 强 瑞 技 术 发布公告： 2025Q1 公 司 实 现 收入 3.17 亿 元 /yoy+111%，实现归母净利润 0.12 亿元/yoy+184%。 投资要点 ▌ 业绩表现抢 ...

2025 年 05 月 05 日 业绩表现抢眼，新业务增长强劲 买入(维持) 事件 分析师：黎江涛 S1050521120002 lijt@cfsc.com.cn | 基本数据 | 2025-04-30 | | --- | --- | | 当前股价（元） | 71.4 | | 总市值（亿元） | 53 | | 总股本（百万股） | 74 | | 流通股本（百万股） | 29 | | 52 周价格范围（元） | 35.35-93.98 | | 日均成交额（百万元） | 205.24 | 市场表现 -50 0 50 100 150 (%) 强瑞技术 沪深300 资料来源：Wind，华鑫证券研究 相关研究 ▌ 业绩表现抢眼，新业务强劲增长 公司 2024 年实现收入 11.27 亿元/yoy+67%，实现归母净利润 0.98 亿元/yoy+75%。业务拆分来看，移动终端 2024 年收入 6.78 亿元/yoy+30%；智能汽车领域实现收入 1.23 亿元 /yoy+182%；Ai 服务器设备实现收入 0.65 亿元/yoy+135%； 散热领域实现收入 1.94 亿元/yoy+357%。 1、《强瑞技术（3011 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 随着晶体管数量的持续增长，我们越来越接近硅的物理和热极限。随着晶体管尺寸的缩小， 漏电流不断增大，每平方毫米产生的热量也越来越难以消散。近年来，业界已转向先进的封 装技术（例如小芯片、3D堆叠和中介层），以突破这些限制，而不是强行突破。如今，性能 提升不再仅仅依赖于缩小晶体管尺寸，而更多地依赖于巧妙的架构、互连和热设计策略。 为了对这些涉及热量和计算机在纳米尺度上工作方式的物理问题给出适当的答案，本文将涉 及热量的基本科学、热量在电子器件中产生的方式和原因，以及我们为控制热量而开发的各 种方法。 热的基础知识 如果你还记得高中物理，热量其实就是构成我们世界的原子和分子的随机运动。当一个分子的动能 高于另一个分子时，我们说它更热。当两个物体接触时，热量会从一个物体传递到另一个物体，持 续传递直到两者达到平衡。这意味着较热的物体会将部分热量传递给较冷的物体，最终温度会介于 两者之间。 传热所需的时间取决于相关材料的热导率。热导率衡量的是材料传导热量的能力。 像泡沫塑料这样的绝缘体具有相对较低的热导率，约为 0.03，而像铜这样的导体具有较高的热导 率，约为 400。在两个 ...

Core Viewpoint - The company is a high-tech enterprise specializing in the research, production, and sales of precision connectors, with a focus on innovation and quality to meet market demands [3][4]. Company Overview - The company has established long-term partnerships with well-known domestic and international enterprises such as Wistron, Transsion Holdings, Xiaomi, and TCL, leveraging its strong quality and service [3]. - The company is expanding its product offerings into industrial connectors, automotive connectors, and new energy connectors, in addition to its core connector products [3]. Business and Product Introduction - The main products include consumer electronic connectors, precision components, and semiconductor packaging thermal management solutions [6][9][10]. - The consumer electronic connectors encompass card connectors, I/O connectors, headphone connectors, and board-to-board (BTB) connectors, widely used in mobile phones and other electronic devices [6][7][8]. - The precision components are produced using Metal Injection Molding (MIM) and 3D printing technologies, providing a one-stop service from product printing to post-processing [9][5]. - The semiconductor packaging thermal management solutions are increasingly important due to the rising heat density in modern electronic products, especially in AI applications [10][11]. Research and Development - The company emphasizes R&D investment and has developed its own 3D printing equipment, entering the mass production phase [4][5]. - The R&D model combines proactive innovation with customer-driven development, ensuring a balance between technological advancement and meeting diverse customer needs [13]. Financial Performance - The company has experienced stable growth in its overall business, but net profit has been under pressure due to increased management and R&D expenses, as well as rising raw material costs [5]. - The company has adjusted its IPO fundraising project to focus on the semiconductor thermal management project, indicating a strategic shift towards high-growth areas [5]. Procurement and Production Model - The procurement process is managed by the materials department, which evaluates suppliers based on price, quality, and delivery time, ensuring a reliable supply chain [14][15]. - The production model is based on a "sales-driven production" approach, allowing for customization according to customer orders, which enhances responsiveness to market demands [16][17].

Core Viewpoint - The article discusses the challenges posed by high-power AI chips, particularly focusing on heat generation and warping issues due to increased power density and chip size, emphasizing the need for efficient thermal interface materials (TIM) to ensure stable and effective operation of AI chips [1][3]. Group 1: High-Power AI Chip Challenges - The rapid development of data centers centered around high-performance AI chips has led to a significant increase in power consumption, exemplified by the H100 chip with a maximum power of 700W and a size of 814mm² [1]. - The reliability of chips decreases by approximately 50% for every 10°C increase in temperature, highlighting the critical importance of effective heat dissipation [1]. Group 2: Thermal Interface Materials (TIM) - Different levels of TIM are categorized, including TIM1.5 (direct connection between bare chip and heat sink), TIM1 (between chip and lid), and TIM2 (between lid and heat sink) [2]. - TIM for high-power large-size chips must meet specific requirements: low bond line thickness (≤0.3mm), low thermal resistance (≤0.1℃cm²/W), and stress absorption to counteract warping [3]. Group 3: Solutions by Hongfu Cheng - Hongfu Cheng has developed a vertical graphene thermal pad that addresses the challenges of heat dissipation for high-power large-size chips, leveraging their experience in oriented carbon fiber thermal pads [4][8]. - The vertical graphene thermal pad achieves a low thermal resistance of 0.04℃cm²/W through orientation technology and appropriate packaging pressure [5]. - The internal porous structure of the thermal pad allows it to adapt quickly to local deformations, preventing material from being pushed out and ensuring long-term reliability [6]. Group 4: Performance Advantages - Compared to traditional thermal interface materials like thermal grease and indium sheets, the graphene thermal pad does not suffer from creep or pump-out risks, maintains a complete thermal interface, and provides uniform heat conduction without hotspots [11]. - The manufacturing process for the graphene thermal pad is simpler and allows for automated assembly, significantly reducing packaging time and equipment costs compared to indium sheets [11]. Group 5: Reliability and Commercialization - The graphene thermal pads have undergone rigorous testing, showing a thermal resistance change rate of less than 5% after 1000 hours of high-temperature and thermal cycling tests, indicating superior reliability compared to conventional materials [7]. - Hongfu Cheng has established automated production lines and achieved mass delivery, gaining recognition from leading companies in the chip industry for product quality [8].