Financial Data and Key Metrics Changes - Camtek reported record revenues of $126 million for Q3, reflecting over 12% growth year-over-year [4][11] - Gross margin was maintained at 51.5%, contributing to a record operating income of over $37.6 million [4][12] - Net income for Q3 was $40.9 million, or $0.82 per diluted share, compared to $30 million, or $0.75 per share in the same quarter last year [12][13] - Cash and cash equivalents increased to $794 million from $543.9 million at the end of the previous quarter [14] Business Line Data and Key Metrics Changes - High-performance computing applications contributed approximately 45% of total revenue, while advanced packaging applications accounted for about 25% [4] - The new products, Eagle G5 and OAK, are expected to contribute approximately 30% of revenue in 2025 [7] Market Data and Key Metrics Changes - Geographic revenue split for the quarter showed Asia accounting for 93% of total revenue, with the rest of the world at 7% [11] - The HBM market is expected to double in the next three years, indicating strong growth potential [9][25] Company Strategy and Development Direction - Camtek is focused on enhancing technological capabilities and maintaining a competitive edge in advanced semiconductor manufacturing equipment [6][10] - The company plans to explore inorganic growth opportunities, with a dedicated team mapping potential M&A targets [41][43] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in 2026 being a growth year, with expectations for a stronger second half compared to the first half [19][25] - The company anticipates a natural time lag between investment announcements and actual equipment purchases, impacting the first half of 2026 [9][19] Other Important Information - The company successfully completed a $500 million convertible notes offering, enhancing its financial flexibility [4][14] - Inventory levels decreased to $142 million, indicating improved planning efficiencies [15] Q&A Session Summary Question: Timing lag between DRAM front-end equipment investment and packaging - Management indicated a comfort level for the second half of 2026 based on customer discussions and order pipelines, but noted difficulty in predicting the first half [18][19] Question: R&D expense outlook - Management confirmed that R&D expenses will continue to increase as an investment for future growth, with no major decline expected [20][22] Question: Strength in China and future expectations - Management expressed confidence in continued investments in China, particularly in the OSAT segment, and expects a healthy market in 2026 [24] Question: HBM and CoWoS dynamics - Management stated that the HPC business remains strong, with no significant changes expected in the contribution from CoWoS and HBM [57] Question: Hybrid bonding opportunities - Management sees hybrid bonding as a moderate revenue opportunity for 2026, with higher volumes expected in 2027 [77] Question: Competitive environment and market share - Management asserted that they have not lost market share and expect to gain more with new technologies and capabilities [69][70]