Company Overview - Adeia Inc. is recognized for its innovative semiconductor 3D integration and advanced packaging technologies, recently winning the "Most Innovative Technology" award at FMS: the Future of Memory and Storage [1][2] - The company focuses on hybrid bonding technology that enhances interconnect density, speed, power efficiency, and reliability in NAND, DRAM, and logic products [2][3] Technology Highlights - Adeia's hybrid bonding technology enables 3D integration of electronic systems, significantly improving performance metrics in semiconductor applications [2][3] - The technology supports submicron interconnect pitch, facilitating chiplet architectures and heterogeneous integration, which reduces latency and increases bandwidth [3] Industry Context - FMS is a premier global event that showcases advancements in high-speed memory and storage technologies, attracting professionals and companies from around the world [4][6] - The event highlights key trends and innovations in sectors such as AI, enterprise data centers, and high-performance computing, emphasizing the importance of memory and storage in these applications [6][7]