Core Insights - SCHMID Group's InfinityLine L+ has won the Innovation Award at productronica 2025 for its advanced Chemical Mechanical Planarization (CMP) solution for large-format substrates, highlighting the company's leadership in next-generation manufacturing [1][3] - The InfinityLine L+ is designed for CMP processing of rectangular substrates and PCBs up to 24.5" × 24.5", enabling sub-5 µm structures in high-volume manufacturing, particularly for advanced packaging technologies [2][5] Technology and Features - The InfinityLine L+ features a novel design where slurry is applied centrally and evenly, supported by a dedicated clamping and backing system, ensuring maximum flatness and process stability [4] - It operates under SCHMID's "Oscar" principle, combining low slurry consumption, high removal rates, and excellent uniformity, with features like platen cooling and variable pressure control to enhance reliability [5] Applications and Market Impact - The InfinityLine L+ sets a new benchmark in advanced packaging by bridging semiconductor wafer processes with next-generation substrate demands, providing a scalable solution for various applications [6] - Target markets include manufacturers of substrates for AI, advanced packaging producers, and photonics companies, indicating a broad applicability of the technology [11]