Core Insights - ACM Research, Inc. has launched its first Ultra ECDP Electrochemical Deplating tool aimed at wide bandgap compound semiconductor manufacturing, enhancing gold etching processes [1][3] Company Overview - ACM Research, Inc. specializes in semiconductor process equipment, including cleaning, electroplating, and packaging tools, aimed at improving productivity and yield in semiconductor manufacturing [6] Product Features - The Ultra ECDP tool supports specialized processes such as Au bump removal, thin film Au etching, and deep-hole Au deplating, featuring integrated pre-wet and cleaning chambers [2] - It utilizes advanced multi-anode electrochemical technology to minimize side etching and enhance surface finish and uniformity [2] - The tool is designed to accommodate various substrates like silicon carbide (SiC) and gallium arsenide (GaAs), with a modular design allowing integration of plating and deplating processes [3][4] Market Context - The compound semiconductor market is experiencing growth driven by demand in electric vehicles, 5G/6G communication, RF, and AI applications, with gold being a preferred material due to its high conductivity and corrosion resistance [3]