Core Insights - ACM Research, Inc. has delivered its first panel electrochemical plating tool, the Ultra ECP ap-p, to a leading panel fabrication customer, highlighting advancements in panel-level electroplating technology and increasing market demand for advanced packaging solutions [1][2][3] Company Developments - The Ultra ECP ap-p is the first commercial panel-level copper deposition system for the large-panel market, supporting various plating processes and achieving performance comparable to traditional wafer processes [2][3] - The system features proprietary horizontal electroplating technology and supports multiple plating materials, including copper, nickel, tin-silver, and gold, with capabilities for tall pillar applications exceeding 300 microns [3] Market Context - The demand for next-generation devices is driving the need for scalable, cost-efficient advanced packaging solutions, with panel-level packaging offering advantages in scalability, throughput, and cost for high-volume production [3]