Core Insights - SCHMID Group has announced the shipment of its first InfinityLine P+ system, a new panel-level plating equipment that integrates photoresist stripping, providing a modern and efficient alternative for manufacturers in the electronics industry [1][10]. Product Features - The InfinityLine P+ is a touch-free, double-sided vertical cluster plating system that can be configured with various plating, pre-treatment, cleaning, and rinsing modules, ensuring uniform copper distribution across the panel through segmented and moveable anodes [3][9]. - The system integrates photoresist stripping directly into the plating workflow, which minimizes handling and transfer steps, resulting in a compact and low-maintenance architecture that reduces both operating and capital costs [4][11]. Competitive Advantage - The InfinityLine P+ is designed to compete effectively against existing plating equipment in dynamic manufacturing environments characterized by frequent design changes, thin seed layers, and stringent process integration requirements [5][11]. - Unique differentiators of the InfinityLine P+ include integrated stripping, segmented current distribution, and reliability on thin seed layers, making it suitable for environments where flexibility and yield are critical [11]. Customer Benefits - The features of the InfinityLine P+ lead to higher equipment uptime, reduced footprint, shorter process chains, and lower total cost of ownership, enhancing overall operational efficiency for customers [7][9]. Market Positioning - The shipment of the first unit marks the beginning of commercialization, with initial customer installations and pilot runs planned for the upcoming quarter, indicating a proactive approach to market entry [12]. - The InfinityLine P+ expands the InfinityLine family, positioning SCHMID Group as a key player in next-generation advanced packaging and high-density PCB applications, offering a competitive alternative to existing plating platforms [13].