Core Viewpoint - The research team from BOE has developed an innovative Micro LED packaging solution that addresses key technical challenges in the industry, such as high sidewall light emission, low optical efficiency, and color deviation [2][4]. Group 1: Technical Innovations - The new packaging structure consists of high-refractive-index transparent glue, white high-reflective resin, micro-lens arrays, and patterned black matrices, effectively improving light extraction and reducing color deviation [4][5]. - By introducing a gradient refractive index layer on the Micro LED chip, the critical angle for light emission has been increased from 25 degrees to a maximum of 65.9 degrees, significantly enhancing top light extraction efficiency [5]. - The white reflective resin forms an isosceles trapezoidal structure between chips, resulting in a 27% increase in brightness at a 0° viewing angle [5]. Group 2: Performance Metrics - Simulation results indicate that with a lens curvature of 0.03 and a refractive index of 1.85, light intensity can be increased by over 53% [5]. - The introduction of a patterned black matrix in the packaging glass layer has effectively reduced reflectivity to less than 2%, achieving a high contrast ratio of over 20,000:1, thereby significantly enhancing display quality [5][7]. Group 3: Market Applications and Future Directions - The new packaging design not only improves optical efficiency and uniformity but also enhances packaging reliability, making it suitable for mass production in automotive displays, AR/VR headsets, and wearable devices [7]. - BOE continues to advance Mini/Micro LED direct display technology and applications, with a presentation scheduled at the 2025 Self-emissive Display Industry Seminar to share the latest developments in direct display COG technology [7][9].