Core Viewpoint - The integrated circuit packaging and testing industry is characterized by rapid technological iteration and intense market competition, necessitating banks to closely monitor industry dynamics and adjust credit management strategies to address potential risks and challenges [1] Group 1: Challenges in the Industry - Difficulty in pre-loan investigation due to the industry's high specialization and technical complexity, leading to a lack of corresponding professional knowledge and assessment tools within banks [2] - Mismatch between the industry's light asset nature and risk mitigation needs, as core value lies in technology and talent rather than fixed assets, complicating post-loan tracking of intangible assets [2] - Lack of personalized post-loan management solutions, as standardized management approaches fail to meet the unique characteristics and differentiated needs of enterprises [2] Group 2: Risk Management Measures - Strengthening internal and external information exchange to diversify information sources, including market research and analysis of enterprise financial reports [3] - Constructing a risk classification evaluation model that combines fundamental analysis with trend judgment to accurately identify risks [4] - Providing customized product configuration strategies by prioritizing support for high-quality enterprises and emerging technology innovation companies [5][6] Group 3: Credit Conditions and Post-Loan Management - Optimizing credit conditions to ensure the safety of credit funds, including reasonable control of credit share and multi-channel risk mitigation measures [8] - Developing differentiated post-loan management plans that focus on different types of enterprises, such as established firms, emerging tech companies, and traditional packaging firms [10] - Conducting timely evaluations of post-loan management effectiveness and adjusting management strategies based on assessment results [13]