1 证券代码：002916 证券简称：深南电路 深南电路股份有限公司投资者关系活动记录表 编号：2025-20 Q5、请介绍原材料价格变化情况及对公司的影响。 Q3、请介绍公司 PCB 业务近年来扩产规划。 公司 PCB 业务在深圳、无锡、南通及泰国（工厂在建）均设有工厂。一方面，公司通过 对现有成熟 PCB 工厂进行技术改造和升级，打开瓶颈，提升产能；另一方面，公司有序推 进南通四期项目建设，构建 HDI 工艺技术平台和产能，目前正在推进项目基础工程建设。公 司将结合自身经营规划与市场需求情况，合理配置业务产能。 Q4、请介绍公司泰国工厂投资规模及业务定位。 公司在泰国工厂总投资额为 12.74 亿元人民币/等值外币。目前基础工程建设按期有序推 进中，具体投产时间将根据后续建设进度、市场情况等因素确定。泰国工厂将具备高多层、 HDI 等 PCB 工艺技术能力，其建设有利于公司进一步开拓海外市场，满足国际客户需求， 完善产品在全球市场的供应能力。 投资者关系 活动类别 √特定对象调研 □分析师会议 □现场参观 □媒体采访 □业绩说明会 □新闻发布会 □路演活动 □其他 （ ） 活动参与人 员（排名不 分先后） ...

丨证券研究报告丨 公司研究丨点评报告丨兴森科技（002436.SZ） [Table_Title] 兴森科技：营收实现增长，坚定发展半导体业务 报告要点 [Table_Summary] 近期兴森科技发布 2024 年年报和 2025 年一季度报告。 2024 年公司实现营收 58.17 亿元，同比增加 8.53%；实现归母净利润-1.98 亿元，同比减少 193.88%。2025Q1 公司实现营收 15.80 亿元，同比增加 13.77%；实现归母净利润 0.09 亿元， 同比减少 62.24%。 分析师及联系人 [Table_Author] 杨洋 王泽罡 SAC：S0490517070012 SAC：S0490521120001 SFC：BUW100 请阅读最后评级说明和重要声明 %% %% %% %% research.95579.com 1 兴森科技（002436.SZ） cjzqdt11111 [Table_Title2] 兴森科技：营收实现增长，坚定发展半导体业务 近期兴森科技发布 2024 年年报和 2025 年一季度报告。 [Table_Summary2] 事件描述 请阅读最后评级说明和重要声明 ...

天津普林电路股份有限公司投资者关系活动记录表 证券代码：002134 证券简称：天津普林 | | □特定对象调研 □分析师会议 | | --- | --- | | 投资者关系 | □媒体采访 业绩说明会 | | 活动类别 | □新闻发布会 □路演活动 | | | □现场参观 □其他（请文字说明其他活动内容） | | 参与单位名称 | 参与公司 2024 年度网上业绩说明会的投资者 | | 及人员姓名 | | | 时间 | 年 月 日 下午 2025 05 19 16:30-17:30 | | 地点 | "约调研"小程序 | | | 董事、总裁：庞东先生 | | 上市公司接待 | 副总裁、财务总监：王泰先生 | | 人员 | 董事会秘书：束海峰先生 | | | 独立董事：杨丽芳女士 | | | 互动问答主要内容如下： | | | 1、问：请问营收和利润增长的原因？ | | | 答：尊敬的投资者，您好！公司 年度营业收入及净利润增长，一 2024 | | | 方面是公司业务量的增长，一方面是泰和电路并表的影响。 | | 投资者关系活 | 2、问：2024 年研发投入大幅增长，这些投入预计在未来多久能转化为 | ...

Core Viewpoint - The PCB industry is experiencing a recovery trend, characterized by structural growth due to the rapid development of emerging industries such as artificial intelligence and smart vehicles, with high-end product demand growing over 10% [1] Group 1: Company Performance - In 2024, the company achieved revenue of 3.266 billion yuan, a year-on-year increase of 12.11%, while net profit was -236 million yuan, a year-on-year reduction in losses by 58.29% [1] - The revenue growth was primarily driven by the ramp-up of production capacity at the Jiangsu Bomin Phase II factory and increased focus on high-end products in AI data centers and smart automotive sectors [1][3] Group 2: Market Trends - The global PCB industry is shifting towards high precision, high density, and high reliability, with high-end PCB products like HDI boards and IC substrates gaining market share due to demand from sectors such as servers, new energy vehicles, and consumer electronics [2] - The company has a 34% market share in the HDI sector and plans to increase the shipment ratio of high-end HDI boards through fundraising projects [2] Group 3: Future Growth Drivers - Future profitability growth will be driven by focusing on high-value products in AI, high-speed communication, and smart automotive sectors, leveraging new production facilities [3] - The company aims to enhance operational efficiency through internal management optimization, supply chain improvements, and cost control measures [4]

Group 1: Company Overview and Strategy - The company focuses on differentiated product competition strategy, relying on technology, management, and service advantages to maintain a balanced product layout and high-end differentiated products [3] - The top five customers reported significant revenue growth in 2024, emphasizing the company's long-term sustainable interests over short-term gains [3] - The company aims to enhance its resilience and competitive advantage through technological innovation and a diversified customer structure [3] Group 2: Capital Expenditure and Market Demand - Increased demand for AI-driven servers and high-speed network infrastructure has led to a rise in market opportunities, with the company investing heavily in key processes [4] - In Q1 2025, the company reported cash outflows of approximately 658 million for fixed assets and long-term assets [4] - A new project for AI chip-compatible high-end printed circuit board expansion is planned with a total investment of approximately 4.3 billion RMB, expected to enhance high-end product capacity [4] Group 3: Industry Challenges and Opportunities - The automotive PCB market faces oversupply in low-end segments, price competition, and fluctuating raw material costs, while also experiencing growth and increased competition [7] - The shift towards smart vehicles is accelerating, with companies focusing on L2-level assisted driving and smart cockpit technologies [7] - The company is leveraging its long-standing expertise in communication equipment and automotive electronics to enhance collaboration with clients in the new energy vehicle sector [7] Group 4: Production and Operational Efficiency - The company is transitioning its Thailand production base from trial to mass production, aiming to achieve expected production efficiency and product quality [8] - Efforts are being made to control initial costs through refined cost management and establish risk warning mechanisms for overseas operations [8]

以下文章来源于财经杂志 ，作者陈汐 刘建中 财经杂志 . 十大行业中 九个集中于电子行业和电力设备行业 。 文 ｜ 陈汐 编辑 ｜ 刘建中 来源｜ 财经杂志（ID：i-caijing） 封面来源 ｜ Pixabay 2025年哪些行业更具增长潜力？这个问题可以从A股上市公司的2024年年报中得到解答。 A股上市公司是各行各业最优秀的代表，它们能比较准确地感知行业冷暖。因为工资存在显著的"棘轮效应"（即涨薪容易，但降薪却会遭到强烈抵触）， 所以，公司通常只会在预期未来业务向好时，才给员工普遍加薪。换句话说，敢于给员工涨薪的公司，往往对前景充满信心。 在一个行业中，认为前途光明的公司越多，说明行业的前景越被看好。我们以A股上市公司作为行业样本，计算每个行业中符合"看好条件"的公司占比。 然后，按照这个占比给各个行业排序，选出前十名，即为"前景最被看好的十大行业"。 这里设置一个"看好条件"（即某公司认为本行业前途光明的判定条件）：某公司员工的平均薪酬涨幅超过5%，且员工人数下降不超过2%（我们也用过 10%和0%的组合，最终选出的十大行业基本相同）。 为了方便讨论，定义一个概念： 《财经》杂志官方微信。《财经》杂 ...

【公告全知道】军民融合+机器人+商业航天+碳纤维+低空经 济+华为!公司军工科技板块产品主要应用于航空、 方向 公告全知道 2025.05.18 22:02 星期日 康达新材:2024年年度股东大会通过多项议案 中京电子(002579.SZ)公告称，公司于2025年4月1日召开第六届董事会第二次会议，提名盛璋为公司非独立董事候选人。2025年 5月16日,公司召开2024年年度股东大会,选举盛璋为公司第六届董事会非独立董事。盛璋历任台资企业三希科技集团广合科技 有限公司多个职务,2013年加入中京电子,现任公司副总经理。 点评: 资料显示，中京电子的主营业务为印制电路板(PCB)的研发、生产、销售与服务。公司主要产品有刚性电路板(RPCB)、 高密度互联板(HDI)、柔性电路板(FPC)、刚柔结合板(R-F)和柔性电路板组件(FPCA)。公司系中国印制电路行业协会(CPCA)及 美国印制电路协会(IPC)会员单位,中国印制电路板百强企业,公司是目前国内少数兼具刚柔印制电路板批量生产与较强研发能 力的PCB制造商，能够同时满足客户不同产品组合需求、快速响应客户新产品开发，为客户提供产品与技术的一体化解决方案。 ...

Core Viewpoint - The company, Shenghong Technology, is making significant investments to enhance its core competitiveness and ensure sustainable development, particularly in response to the growing demand for AI computing hardware [1][4]. Group 1: Investment Plans - Shenghong Technology plans to invest no more than 3 billion yuan in 2025 for fixed assets and intangible assets, focusing on new factory construction, equipment procurement, and automation line upgrades [1][4]. - The investment is seen as a strategic move to accelerate the release of AI computing hardware capacity and deepen global expansion [1][4]. Group 2: Financial Performance - In Q1 2025, Shenghong Technology achieved a revenue of 4.312 billion yuan, representing an 80.31% year-on-year increase, and a net profit of 921 million yuan, up 339.22% year-on-year [2][3]. - For the full year 2024, the company reported a revenue of 10.73 billion yuan, a 35.31% increase, and a net profit of 1.154 billion yuan, a 71.96% increase [2][3]. - The company's gross margin rose to 33.37%, up 13.89 percentage points year-on-year, while the net margin reached 21.35%, up 12.58 percentage points year-on-year, significantly exceeding the global PCB industry average of 10%-15% [2][3]. Group 3: Market Outlook - Shenghong Technology anticipates continued growth in downstream industries such as automotive electronics and server/data storage, driven by AI, which will support high growth in multilayer boards and packaging substrates [3]. - The company expects a quarter-on-quarter net profit growth of no less than 30% in Q2 2025, with a year-on-year increase exceeding 360% for the first half of 2025 [3]. Group 4: Capacity Expansion and Globalization - To meet the surge in orders, Shenghong Technology is accelerating capacity expansion, with plans to raise up to 1.98 billion yuan through a stock issuance for overseas projects in Vietnam and Thailand [4]. - The company has a strong order backlog and a good capacity utilization rate, with new capacity expected to come online in June 2025, significantly enhancing its high-end HDI and multilayer production capabilities [4]. - Shenghong Technology has been focusing on globalization, with over 50% of its orders coming from overseas, achieved through acquisitions and investments in foreign factories [4]. Group 5: R&D and Innovation - The company has invested over 2 billion yuan in R&D since its listing, establishing comprehensive technological capabilities across the PCB industry chain [4][5]. - Shenghong Technology holds 399 patents, with innovations in AI computing, robotics, low-altitude economy, and autonomous driving, and has established partnerships with leading companies in the humanoid robotics sector [5]. - The company plans to continue increasing R&D investment to enhance product competitiveness and provide high-quality products and services to global customers [5].

证券代码：300903 证券简称：科翔股份 广东科翔电子科技股份有限公司 投资者关系活动记录表 编号：2025-001 | 投资者关系活动类别 | ☐特定对象调研 ☐分析师会议 | | --- | --- | | | ☐媒体采访 业绩说明会 | | | ☐新闻发布会 ☐路演活动 | | | ☐现场参观 | | | ☐其他 | | 参与单位名称及人员姓名 | 线上参与公司2024年度网上业绩说明会的全体投资者 | | 时间 | 2025年05月16日（周五）15:00-16:00 | | 地点 | 价值在线（https://www.ir-online.cn/）网络互动 董事长兼总经理：郑晓蓉女士 | | | 职工代表董事：康国峰先生 董事会秘书：郑海涛先生 | | 上市公司接待人员姓名 | 副总经理：位珍光先生 | | | 财务总监：刘涛先生 | | | 保荐代表人：张开军先生 | | | 独立董事：赵玉洁女士 | | | 1.公司800G光模块上市了吗？ | | 投资者关系活动主要内容 | 答：尊敬的投资者，您好！公司目前已掌握100G，200G， | | | 400G光模块用PCB技术，实现高速连接器用P ...