Core Viewpoint - Mobix Labs, Inc. has announced a public offering of 30,000,000 shares of common stock, aiming for gross proceeds of approximately $6.0 million, which will support its growth initiatives and M&A strategy [1][2][3] Group 1: Offering Details - The public offering is expected to close on January 7, 2026, pending customary closing conditions [1] - D. Boral Capital is acting as the Sole Placement Agent for the offering [2] - The offering is conducted under a "shelf" registration statement on Form S-3, with a preliminary prospectus supplement filed with the SEC [3] Group 2: Use of Proceeds - The net proceeds from the offering will be utilized for working capital and general corporate purposes, including accelerating growth initiatives and advancing M&A strategies [2][3] - The company aims to expand its technology portfolio and enhance its capabilities in military, defense, aerospace, and connectivity markets [2][6] Group 3: Company Overview - Mobix Labs designs and develops advanced connectivity solutions, including RF, switching, and EMI filtering technologies, targeting various sectors such as defense and aerospace [6] - The company plans to pursue acquisitions of revenue-generating companies to enhance its product offerings and expand into strategically aligned industries [6]

Core Insights - Mobix Labs Inc. will participate in the 2025 Leidos Supplier Innovation & Technology Symposium on August 7, 2025, in Washington, D.C. [1] - The company's wireless division, RaGE Systems, will showcase innovations in RF and wireless technologies, including millimeter-wave sensor development and advanced communication solutions [2][4] - The symposium serves as a platform for collaboration between Leidos technology leaders and strategic suppliers, highlighting advancements in defense and commercial technologies [3] Company Overview - Mobix Labs is a U.S.-based supplier of advanced connectivity solutions targeting aerospace, defense, AI, and 5G infrastructure markets [9] - The company specializes in performance-critical RF, optical, and electromagnetic interference interconnect technologies through proprietary semiconductor IP and vertically integrated manufacturing [9]