Core Viewpoint - The article highlights the significance of Teisan Resin, a high-purity acrylic copolymer produced by Nagase ChemteX, as a crucial material for electronic adhesive films due to its outstanding properties such as low thermal expansion, low modulus, high heat resistance, and high reliability [3][4]. Product Overview - Teisan Resin is utilized in the production of electronic adhesive films, specifically ACF (Anisotropic Conducting Film) and DAF (Die Attach Film), which are essential for electronic packaging and display module connections [4][6]. - The resin is produced using a unique suspension polymerization process, resulting in high purity and a narrow molecular weight distribution [7][22]. Product Characteristics - **Low Thermal Expansion Coefficient (Low CTE)**: Teisan Resin exhibits minimal expansion when heated, enhancing bond dimensional stability in smaller electronic products [11][12]. - **Low Modulus**: The low modulus of Teisan Resin aids DAF films in reducing stress and improving packaging reliability [13][14]. - **Low Tg**: The resin increases the wetting properties of DAF film substrates, allowing for lower temperature mounting [15][16]. - **High Purity**: Compared to conventional solution and emulsion polymerization processes, Teisan Resin has minimal residual monomers and low molecular weight components, with few impurities due to the absence of surfactants during polymerization [17][18]. - **High Heat Resistance**: The polymer backbone of Teisan Resin consists of saturated carbon chains, providing durability and preventing bond degradation due to oxidation or heating [19][20]. - **Narrow Molecular Weight Distribution**: The special suspension polymerization process results in a high polymerization rate and degree, yielding a polymer with a narrow molecular weight distribution [21][22]. Product Specifications - Four solvent-based resins are currently marketed in China, each with different functional groups and properties: SG-P3, SG-70L, SG-708-6, and SG-600 TEA [7][9].