Core Insights - DuPont is participating in the Total Solution Exhibition for Electronic Equipment 2025 (JPCA Show 2025) to showcase its advanced interconnect solutions [1][2] - The company emphasizes its commitment to innovation in the electronics industry, particularly in integrated circuit (IC) substrates and advanced printed circuit boards (PCBs) [2] - The demand for high-performance IC substrates is increasing, driven by the growth of artificial intelligence (AI) technologies [2] Company Offerings - DuPont provides a range of solutions for IC substrate manufacturers, including Circuposit™ desmear and electroless copper, Copper Gleam™ electrolytic copper, and Microfill™ acid copper [3] - The Circuposit™ SAP8000 electroless copper technology is specifically designed for AI server CPU and GPU chip applications, optimizing for low roughness dielectrics [5] - Microfill™ SFP-II-M acid copper is tailored for high-performance computing and AI chip applications, ensuring excellent pattern uniformity [6] Advanced Materials - Riston® dry film photoresists enable fine line direct imaging for IC substrate applications, ensuring high-yield performance [7] - CYCLOTENE™ dry-film photo-imageable dielectric is designed for fan-out panel level packages, providing excellent coplanarity and reliability [8] - Pyralux® ML laminates offer a non-copper-based solution for high-performance markets, leveraging advanced polyimide technology [9][10]