Core Insights - DuPont de Nemours, Inc. has introduced a new portfolio of advanced circuit materials and solutions aimed at enhancing fine-line technology, signal integrity, and thermal management at the 2025 International Electronic Circuits Exhibition in Shanghai [1] - The demand for high-performance devices driven by advancements in AI, machine learning, and 5G technologies is propelling innovations in packaging substrates and advanced PCBs, with DuPont leveraging its material science expertise to cater to this growing market [2] Product Offerings - DuPont's IC substrate solutions encompass a wide range of products including dielectrics, metallization chemistries for electroless copper seed layers, redistribution layers, copper pillars, solder bumps, and dry film imaging photoresists, addressing challenges in performance, miniaturization, reliability, and cost efficiency [3] - The company's PCB market solutions feature products such as DuPont Circuposit SAP8000 electroless copper, DuPont Microfill SFP-II-M acid plating copper, and various dry film photoresists [4] Financial Outlook - For the full year 2025, DuPont anticipates net sales between $12,800 million and $12,900 million, with operating EBITDA projected at $3,325 million to $3,375 million and adjusted earnings expected to be between $4.30 and $4.40 per share [7] - In the first quarter of 2025, net sales are forecasted to be around $3,025 million, with operating EBITDA of approximately $760 million and adjusted earnings of about 95 cents per share [7] Market Performance - DuPont's shares have experienced a slight decline of 0.1% over the past year, contrasting with a more significant 15.7% decline in the industry [6]