Core Insights - nVent Electric plc has introduced new modular liquid cooling solutions aimed at meeting the cooling requirements of next-generation AI chips, showcasing these innovations at SC25 [1][3][12] - The company is collaborating with Siemens to develop a liquid cooling and power reference architecture tailored for hyperscale AI workloads [8] Product Offerings - The new product portfolio includes modular and scalable row-based coolant distribution units (CDUs), next-generation power distribution units (PDUs), and advanced technology cooling system manifolds [3][4] - nVent's CDUs and PDUs feature a common control platform designed to enhance reliability and improve user experience for data center operators [3] Industry Collaboration - nVent is participating in Project Deschutes, exhibiting a new CDU design based on Google's specifications, which aims to accelerate the adoption of liquid cooling in data centers [9] - The company is leveraging its extensive experience and technical expertise to address unique challenges faced by customers in the data center industry [2][7] Educational Initiatives - nVent will host "Tech Talks" at SC25 to provide insights into new products and address critical industry questions, supporting data center managers in deploying the latest AI technology [11] - Industry experts from nVent, NVIDIA, Lenovo, HPE, and AMD will participate in a panel discussion on the evolution of liquid cooling technology [10] Marketing Campaign - nVent is launching a new marketing campaign titled "We Do Cool Stuff" to highlight its leadership and innovation in the data center industry [12][13]