香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對 其準確性或完整性亦不發表任何聲明，並明確表示，概不對因本公告全部或任何部份 內容而產生或因倚賴該等內容而引致的任何損失承擔任何責任。 ASMPT LIMITED （於開曼群島註冊成立之有限公司） （股份代號：0522） 新聞稿 ASMPT宣布SMT解決方案分部之 策略方案評估 題為《ASMPT宣布SMT解決方案分部之策略方案評估》的新聞稿附載於本公告。 承董事會命 董事 黃梓达 香港，二零二六年一月二十一日 於本公告日期，本公司董事會成員包括獨立非執行董事：樂錦壯先生（主席）、 張仰學先生、蕭潔雲女士及許明明女士；非執行董事： Hichem M'Saad 博士及 Paulus Antonius Henricus Verhagen 先生；執行董事：黃梓达先生及 Guenter Walter Lauber 先生。 （本公告之中英文版本如有任何歧義，概以英文版本為準。） ASMPT宣布SMT解決方案分部之策略方案評估 （二零二六年一月二十一日，新加坡訊）— ASMPT（香港交易所股份代號：0522），一間 全球領先之半導體和電子產品製造的集 ...

Financial Data and Key Metrics Changes - The company reported revenue of $468.0 million for Q3 2025, an increase of 7.6% quarter-on-quarter and 9.5% year-on-year, primarily driven by growth in SMT [9][10] - Adjusted gross margin for Q3 was 37.7%, lower than typical levels due to a larger contribution from SMT and lower SEMI gross margin [10][11] - Adjusted net profit was HKD 101.9 million, down 24.4% quarter-on-quarter but up 245.2% year-on-year [11] - The group achieved a book-to-bill ratio of 1.04 for the quarter, maintaining a ratio above one since Q1 2025 [10] Business Line Data and Key Metrics Changes - SEMI segment revenue was $240.5 million, down 6.5% quarter-on-quarter but up 5.0% year-on-year, driven by demand for wire bonders and die bonders [13] - SMT segment revenue was $227.5 million, up 28% quarter-on-quarter and 14.6% year-on-year, supported by AI servers and EV demand in China [15] - SEMI's adjusted gross margin was 41.3%, lower than normal due to a higher contribution from wire bonders and lower TCB revenue [14] Market Data and Key Metrics Changes - The company noted strong demand in China driven by EVs and high factory utilization across all sectors [3] - The group expects Q4 2025 revenue to be between $470 million and $530 million, indicating growth supported by momentum in both SEMI and SMT [17] Company Strategy and Development Direction - The company aims to solidify its leadership in TCB technology, particularly in HBM4, and anticipates a total addressable market exceeding $1 billion by 2027 [17] - The strategic restructuring, including the voluntary liquidation of the Sun Churn AEC plan, is expected to enhance cost competitiveness and operational agility [8] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in the outlook for TCB demand, citing a strong AI tailwind and ongoing investments in AI infrastructure [31] - The company acknowledged uncertainties in the automotive and industrial markets but noted a stable demand from China [17] Other Important Information - The company experienced an isolated booking cancellation in Q3 for panel deposition tools, which was a one-off occurrence [9][10] - The group closed the quarter with a backlog of $867.7 million [10] Q&A Session Summary Question: HBM4 Transition and Market Share - Management confirmed they are a primary supplier for the HBM4 market, having secured orders from two major HBM players [20][23] Question: Advanced Packaging Demand Pause - Management indicated that the pause in demand was due to the timing of key customers' technology roadmaps, with confidence in future orders aligning with new architecture launches [25][26] Question: Operating Expenses and Future Projections - Management stated that operating expenses would remain similar to prior years, with ongoing investments in R&D and infrastructure [36][37] Question: TCB Fluxless Application Timeline - Management expects significant ramp-up for fluxless TCB applications in 2026, as the industry moves towards higher stacking [38][40] Question: Customer Concentration and Future Opportunities - Management noted a broadening of TCB customer base beyond leading foundries, engaging with top AI customers globally [64] Question: Gross Margin Outlook for SEMI Solutions - Management anticipates slight margin accretion for SEMI in Q4, with expectations for gross margins to return to mid-40% levels in the long run [59][60]