Core Insights - Amkor Technology reported a full-year revenue of $6.7 billion, reflecting a 6% increase, with strong growth across computing, automotive, consumer, and stabilized communications markets [1][4][6] - The company achieved record revenue in computing and expects continued growth in 2026, particularly in advanced packaging and computing sectors [4][5][16] Financial Performance - For the fourth quarter, Amkor reported revenue of $1.89 billion and EPS of $0.69, exceeding guidance, with a year-over-year increase of 16% despite a sequential decline of 5% [3][6] - Gross profit for the quarter was $315 million, with a gross margin of 16.7%, including a one-time benefit of approximately $30 million from asset sales [2][6] - Full-year gross profit was $939 million, with a gross margin of 14%, and net income totaled $374 million, resulting in an EPS of $1.50 [7] 2026 Guidance and Strategy - Amkor guided Q1 2026 revenue to be between $1.6 billion and $1.7 billion, indicating a 25% year-over-year growth at the midpoint, with expected lower seasonal margins [5][12] - The company plans capital expenditures of $2.5 billion to $3.0 billion for 2026, focusing on facility expansion and advanced packaging capacity [14][15] - Strategic priorities include enhancing technology leadership, expanding geographic footprint, and investing in advanced packaging platforms critical for AI and high-performance computing [9][10][11] Market Outlook - The company anticipates strong growth in computing, expected to exceed 20%, along with continued growth in advanced automotive, while other segments are projected to grow in single digits [16][19] - Amkor is optimistic about demand in communications, particularly related to iOS, and expects a solid performance in Android markets [18] - In the automotive sector, while overall unit sales are flat, the semiconductor content per vehicle is increasing due to the shift towards hybrid and electric vehicles [19] Operational Developments - The Vietnam facility reached break-even in Q4, and construction of the Arizona campus is underway, with a focus on expanding advanced packaging capacity [8][11][20] - The company is prioritizing high-density fan-out (HDFO) and other advanced packaging technologies, with new programs expected to launch in 2026 [10][11]