Core Viewpoint - ACM Research, Inc. has launched the Ultra ECDP tool designed for high-precision electrochemical deplating in wide bandgap compound semiconductor manufacturing, addressing challenges in gold etching and plating [1][3]. Company Overview - ACM Research, Inc. specializes in semiconductor process equipment, including cleaning, electroplating, and packaging tools, aimed at enhancing productivity and yield in semiconductor manufacturing [6]. Product Features - The Ultra ECDP tool supports processes such as Au bump removal, thin film Au etching, and deep-hole Au deplating, featuring integrated pre-wet and cleaning chambers for improved efficiency [2]. - It utilizes advanced multi-anode electrochemical technology to minimize side etching and enhance surface finish and uniformity across features [2]. - The tool is compatible with 6-inch and 8-inch platforms and accommodates various wafer sizes, including 150 mm, 159 mm, and 200 mm, providing flexibility for different manufacturing environments [4]. Market Context - The compound semiconductor market is experiencing growth driven by demand from sectors such as electric vehicles, 5G/6G communication, RF, and AI applications, with gold being a preferred material due to its high conductivity and corrosion resistance [3].