Summary of Key Points from Conference Call Records Industry Overview - The conference call discusses advancements in the power supply and cooling technologies within the data center industry, particularly focusing on 800V HVDC and SST architectures, as well as liquid cooling solutions. Core Insights and Arguments - **800V HVDC Implementation**: Expected to be adopted in data centers by Google and Meta starting in the second half of 2024, with foreign suppliers like Delta and Vitec receiving small-scale orders for ±400V and 800V HVDC systems [2][4] - **SST Architecture**: Considered the ultimate iteration direction for NV power architecture, with significant feedback anticipated by Q2 2026 from companies like Delta and Eaton [2][5] - **Power Module Advancements**: The Vera Rubin power module's capacity has increased from 5.5kW to 18.3kW, with a single PowerShelf reaching 110kW, indicating a substantial enhancement in power density [1][4] - **Cost and Value Dynamics**: The introduction of GaN solutions is expected to increase both the cost per watt and the overall value, while maintaining a stable cost trajectory [1][4] - **Back Power Supply Innovations**: The back power supply mechanism aims to shorten power transmission distances significantly, enhancing efficiency by embedding inductors and capacitors within the PCB layers [6][5] - **Liquid Cooling Developments**: The Rubin generation returns to a large cold plate model, with microchannel dimensions reduced from 150μm to 100μm, and potential material changes in TIM1 from gallium-based alloys to indium metals [1][7] - **Diamond Heat Dissipation**: Diamond's thermal conductivity is 3-4 times higher than copper, with commercial deliveries of diamond solutions already noted, indicating a shift in cooling technology [9][8] Additional Important Insights - **Two-Phase Liquid Cooling Challenges**: Progress in two-phase cooling is slower due to environmental constraints and system complexity, making it less favorable compared to microchannel and diamond solutions [10] - **Future Technological Pathways**: The Ultra and FEMEN stages may introduce more advanced microchannel cooling and diamond heat dissipation technologies, with ongoing testing and potential integration into future designs [8][9] - **Market Dynamics**: The competitive landscape may shift as domestic suppliers begin to engage with Rubin projects, particularly if they transition to more mature microchannel solutions [8][9] This summary encapsulates the critical developments and insights from the conference call, highlighting the evolving landscape of power supply and cooling technologies in the data center industry.