晶圆厂专家解读代工、设计景气度

Summary of Conference Call Records Company and Industry Overview - The conference call discusses the semiconductor industry, specifically focusing on wafer fabrication capacity, pricing trends, and customer demand across various platforms including BCD, CIS, and power devices [1][2][3][4][5]. Key Points and Arguments 1. Wafer Fabrication Capacity and Output - Planned wafer fabrication capacity is 95K, but actual output is around 87K due to incomplete recovery of HBT and CIS modules. Expected output to exceed 90K by August [1][2]. - Capacity ramp-up began at the end of last year, with Q2 output nearing 90K. BCD platform is currently the most robust, accounting for over 25K [1][2]. 2. Pricing Trends and Increases - General increase in foundry prices, with BCD experiencing significant hikes. Domestic clients are more aggressive in price increases compared to international clients [1][3]. - eTox prices increased by over 10 percentage points last month, with expected increases of 10 to 15 percentage points this month. ASP grew approximately 5% quarter-over-quarter after discount removal, but revenue impact will lag until Q3 [1][3][5]. 3. Customer Demand and Capacity Allocation - Major customers for BCD include MPS, with demand at 23K but actual allocation at 16K due to capacity balancing issues. Other notable customers include 英吉星 and 艾维 [1][2][3]. - CIS demand from major customer 格科微 is between 9K to 10K, showing a decline from earlier in the year. Display driver demand is high, but capacity and pricing negotiations are ongoing [1][4]. 4. Power Devices and Future Plans - Current inventory for power devices is approximately 30K, with low-voltage demand primarily from 新洁能 and IGBT demand from 士兰微. Future expansion plans focus on high-voltage and 40nm MCU nodes, with an expected increase of 40K units next year [1][4][5]. - The company plans to abandon low-voltage MOS production in favor of high-voltage products, including IGBT and super MOS, due to better profit margins [5]. 5. Product Pricing and Profit Margins - Highest product prices are for CIS BSI process products, priced at approximately $2,400 to $2,500. eFlash products range from $1,700 to $1,900, while BCD and general logic products are priced between $1,100 and $1,700 [1][5]. - Power device pricing includes super MOS at $900 to $1,100, IGBT at $800 to $900, and D-MOS at $500 to $700. Specialty products may exceed $900 but are not mainstream [5]. Other Important Insights - The company is adjusting its production plans weekly based on market conditions and customer demand, with a focus on high-margin products [5]. - There is a noted discrepancy between customer demand and actual production capacity, particularly in the MCU and NOR Flash segments, indicating potential growth opportunities if capacity can be expanded [4][5].